⚡ 本页包含 AI 生成的分析内容，仅供参考
本文探讨了AI对半导体行业的重塑作用，重点分析了先进封装、电源管理、热管理、高带宽内存、互连和无线通信等关键技术方向，旨在推动可扩展且高能效的架构创新。
AI is redefining the semiconductor landscape. Exponential growth in compute, bandwidth, and power efficiency is driving the proliferation of agentic and physical AI. The paradigm is shifting from performance alone to breakthroughs in scalable and energy-efficient architectures and cross-layer system innovation with close cooperation across silicon, design, heterogeneous- hardware integration, and software. This plenary paper explores the key vectors of advanced packaging, power delivery, thermal management, high-bandwidth memory, interconnects, and wireless communication that will shape intelligent robust AI systems for the decade ahead. 1.0 The Growth of AI, Unleashing Opportunities and the IC Ecosystem Given these benefits, the market is set to grow dramatically. GenAI-capable smartphones are expected to hit ~730 million annual units by 2028, and AI PCs are forecast to reach ~167 million units by 2027 [23], with dedicated Neural Processing Units (NPUs) becoming
Vice Chairman and CEO, MediaTek, Hsinchu, Taiwan, Abstract