⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文探讨了AI超级周期对计算性能的需求增长，指出传统EDA方法已无法满足超过2000亿晶体管和小芯片架构的设计挑战，提出通过“设计支持AI”和“AI辅助设计”的双向策略，并引入多智能体编排的agentic AI方法来应对复杂硅与系统设计。
Cadence, San Jose, CA Abstract The AI supercycle is rapidly increasing demand for compute performance and scalability across all levels, from data centers to edge devices. By 2030, the semiconductor total addressable market (TAM) is projected to reach $1.2T with electronic systems at $5.2T. With silicon designs surpassing 200 billion transistors and chiplet-based architectures becoming common, traditional electronic-design-automation (EDA) workflows are insufficient. This plenary discusses how agentic AI can be applied to complex silicon and system design tasks through multi-agent orchestration and iterative reasoning, outlining a framework for its use in EDA solutions, highlighting some of the challenges, and exploring future directions. From optimizing power, performance, and area of silicon to managing data centers, AI-powered solutions are critical for the engineers designing the next
Anirudh Devgan, President and CEO