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ISSCC 2026Session 1 · PLENARYPlenary

ISSCC 2026 / February 16, 2026 / 9:50 AM 1 Empowering the Next Wave of Silicon Engineers Hope Giles

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该文论述了定制芯片在实现产品突破性性能与能效中的关键作用,提出全栈优化与设计模块化是应对SoC扩展挑战的有效方法。同时探讨了人工智能等新兴应用对芯片设计与人才培养的深刻影响。

💡 主要创新点

重要性
发表年份
ISSCC 2026

🏷 关键词

定制芯片全栈优化设计模块化人工智能SoC扩展

📄 原文摘要

Abstract Developing custom chips for specific applications enables fundamentally better products. As part of a full-stack optimization approach to product design, application-specific systems-on-chips (SoCs) have been one of the keys to delivering game-changing performance, power efficiency, capabilities, and user experiences. This plenary provides examples of how custom silicon enables innovative product breakthroughs and how techniques like design modularity help manage the SoC scaling challenge. As applications, such as artificial intelligence (AI), transform both silicon demand and design methodologies, we need to reimagine how we motivate and educate the next generation of silicon engineers to address these challenges. We will share our experiences in interactions between industry, universities, and students, showing how industry engagement can re-energize these programs. The future of custom silicon depends on all

👥 作者与机构

Vice President, Hardware Technologies

Apple, Cupertino, CA

分类:Plenary · 年份:ISSCC 2026