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ISSCC 2026Session 18 · TECHNOLOGY AND CIRCUITS FOR DOMAIN-SPECIFIC ACCELERATORSOther28nm CMOS

A 3.19pJ/b Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-to-6 Wavelength-Flexible Link Capacity for Photonic Interposers

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📋 论文概要

本文提出了一种基于28nm工艺和光子中介层的电光路由器,通过18ns快速链路建立和1至6波长灵活容量,实现了chiplet之间的非最近邻通信,能效为3.19pJ/b。解决了全局互连仅限于最近邻通信的问题。

💡 主要创新点

核心指标
3.19pJ/b 能效,18ns 链路建立时间,1-to-6 波长容量
工艺节点
28nm CMOS
重要性
发表年份
ISSCC 2026

🏷 关键词

电光路由器chiplet互连光子中介层帧级路由波长灵活

📄 原文摘要

Vincent Josselin2, Stéphane Malhouitre2, Laurent Mendizabal2, André Myko2, Damien Saint Patrice2, Rémi Vélard2, Jean Charbonnier2 CEA-List, Grenoble, France, 2CEA-Léti, Grenoble, France 1 Abstract Global interconnect on interposers between chiplets is currently mostly limited to nearestneighbor communication. We propose an electro-optical router in 28nm on a photonic interposer to handle queuing and routing between dies and optical link drivers capable of 18ns link setup time for frame-level routing, with 1-to-6 lambda flexible wavelength capacity. Compact analog drivers and standard-cell-based SerDes and clocking achieve 0.007mm2 active area per link and 3.19pJ/b power. Chiplet stacking using 3D and 2.5D integration has been a major evolution of large compute chips, using different possible integration schemes on organic, silicon or CMOS interposers. Nevertheless, global interconnects are facing multiple scaling issues with increasing

👥 作者与机构

Yvain Thonnart1, Christian Bernard2, Stéphane Bernabé2, Myriam Assous2, Laura Boutafa2, Benoit Charbonnier2, Rémi Franiatte2, César Fuguet1, Olivier Guille2,

分类:Other · 年份:ISSCC 2026