⚡ 本页包含 AI 生成的分析内容,仅供参考
本文提出了一种基于28nm工艺和光子中介层的电光路由器,通过18ns快速链路建立和1至6波长灵活容量,实现了chiplet之间的非最近邻通信,能效为3.19pJ/b。解决了全局互连仅限于最近邻通信的问题。
Vincent Josselin2, Stéphane Malhouitre2, Laurent Mendizabal2, André Myko2, Damien Saint Patrice2, Rémi Vélard2, Jean Charbonnier2 CEA-List, Grenoble, France, 2CEA-Léti, Grenoble, France 1 Abstract Global interconnect on interposers between chiplets is currently mostly limited to nearestneighbor communication. We propose an electro-optical router in 28nm on a photonic interposer to handle queuing and routing between dies and optical link drivers capable of 18ns link setup time for frame-level routing, with 1-to-6 lambda flexible wavelength capacity. Compact analog drivers and standard-cell-based SerDes and clocking achieve 0.007mm2 active area per link and 3.19pJ/b power. Chiplet stacking using 3D and 2.5D integration has been a major evolution of large compute chips, using different possible integration schemes on organic, silicon or CMOS interposers. Nevertheless, global interconnects are facing multiple scaling issues with increasing
Yvain Thonnart1, Christian Bernard2, Stéphane Bernabé2, Myriam Assous2, Laura Boutafa2, Benoit Charbonnier2, Rémi Franiatte2, César Fuguet1, Olivier Guille2,