← 返回论文列表 📄 下载原文 PDF  ISSCC 2026 · 20.6
ISSCC 2026Session 20 · RF TRANSCEIVER SUBSYSTEMS FROM CM-WAVE TO THZRF & Wireless35nm GaN HEMT

A 330-to-344GHz GaN Power Amplifier with Maximum-Available-Gain-Boosting Technique and Compact Tandem Coupler Achieving 86mW Output Power at 340GHz

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文展示了一款采用35nm GaN HEMT工艺的330-344 GHz功率放大器,通过最大可用增益提升技术和紧凑型Tandem耦合器,解决了太赫兹频段增益低、合路损耗大的问题。最终实现了超过21dB增益和18dBm饱和输出功率,峰值功率密度达0.925W/mm。

💡 主要创新点

核心指标
增益>21dB, 饱和输出功率>18dBm (峰值19.3dBm), 功率附加效率>0.6%, 功率密度>0.925W/mm
工艺节点
35nm GaN HEMT
重要性
发表年份
ISSCC 2026

🏷 关键词

GaN功率放大器太赫兹最大可用增益提升Tandem耦合器级联架构

📄 原文摘要

Tianjin University, Tianjin, China *Equally Credited Authors (ECAs) 1 4 Abstract This paper demonstrates a 330-to-344GHz GaN power amplifier (PA), fabricated using a 35nm GaN HEMT process with a 15-stage cascaded architecture. The maximum-availablegain-boosting technique enhances the high frequency gain, while the miniaturized Tandem coupler reduces port reflection and combining losses. The PA achieves >21dB gain, >18dBm saturated output power (PSAT), and >0.6% power-added efficiency. The peak PSAT reaches 19.3dBm at 340GHz, with a power density exceeding 0.925W/mm. The 340GHz frequency range, serving as a critical “atmospheric window,” plays an indispensable role in systems such as high-frequency communications and radar imaging. Traditional silicon-based (CMOS and SiGe) and III-V (GaAs and InP) power amplifiers (PAs) have exhibited marginal improvements in saturated output power (Pout) within this frequency

👥 作者与机构

Weibo Wang*1,2, Wenhua Chen*3, Kenan Xie*4, Chenjie Luo2, Yibin Zhang2, Dechun Shang2, Ziwei Jiang2, Guodong Yu2, Yan Chen2, Keping Wang4

National Key Laboratory of Solid-State Microwave Devices and Circuits, Nanjing, China, 2Nanjing Electronic Device Institute, Nanjing, China, 3Tsinghua University, Beijing, China,

分类:RF & Wireless · 年份:ISSCC 2026