⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出了一款6.4Tb/s的共封装光学ASIC，集成了64路直接驱动TIA和64路重定时分段马赫-曾德尔调制器驱动器，采用7nm FinFET工艺，实现了4.2pJ/b的能效，解决了AI集群中高带宽光互连的功耗和密度问题。
4Tb/s co-packaged optics ASIC integrates 64 ingress path direct-drive TIAs and 64 egress path retimed segmented Mach-Zehnder modulator drivers in 7nm FinFET. The 7nm ASIC is 3D packaged with a photonics IC (PIC) and achieves an energy efficiency of 4.2pJ/b. At 106.25Gb/s, its PAM-4 TIA has a sensitivity better than -11dBm and a BER floor better than 1E-9. The transmitted PAM-4 optical eye achieves a TDEQ of 1.48dB and an extinction ratio of 4.57dB. Optical interconnects are gaining importance for the high-bandwidth communication needs of the scale-out AI clusters, replacing the pluggable modules. Co-packaged optics (CPO) is a heterogeneous integration technology to address the bandwidth and power consumption challenges by enabling scaling through integration. The shortened chip-to-chip
Mahdi Kashmiri, Ajay Yadav, Jin Namkoong, Behrooz Nakhkoob, Tony Kao, Shen Shen, Vaibhav Pandey, Kuan-Chang Chen, Jinho Han, Sudheer Gaddam,
Shayan Kazemkhani, Sang Young Kim, Simar Maangat, Bo Nguyen, Mike Robinson, Hiva Hedayati Broadcom, San Jose, CA Abstract A 6