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本文提出了一款工作于234-252GHz的双极化单站CMOS收发器，采用天线封装(AiP)技术实现交叉极化感知。通过低成本标准有机封装实现了>200GHz的无源天线与互连，辐射效率达69%，相比传统全片上方案节省了硅面积，验证了在亚毫米波频段使用封装集成的可行性。
Abstract We present a 234-to-252GHz dual-polarized monostatic CMOS (Intel16) transceiver for cross-polarimetric sensing, with antenna-in-package (AiP) technology and a 10&10mm2 modular system assembly. The AiP achieves 69% peak radiation efficiency estimated from measurements, which demonstrates the feasibility of >200GHz passive antenna/interconnects implemented in low-cost standard organic packages for enhanced performance and silicon area-saving, as opposed to the traditional all-on-chip scheme. Sub-THz transceivers are favored in radar sensing applications for their low cost, small size, and high resolution. Typical automotive and security sensing requires the radar transceivers to receive echoed signal within the same polarization as the transmitted wave, since most radar objects have isotropic radar cross-section (RCS), and only generate tiny crosspolarized reflection. On the other hand, for low-power THz applications, such as THz IDs
Xibi Chen1, Georgios C. Dogiamis2,3, Ruonan Han1
Massachusetts Institute of Technology, Cambridge, MA, 2Intel, Chandler, AZ, 3Deca Technologies, Tempe, AZ