技术领域

AI / ML

231 篇相关论文 (2008–2026)

ISSCC 2025 Session 14 AI / ML
A 28nm 192.3TFLOPS/W Accurate/Approximate Dual-Mode-Transpose Digital 6T-SRAM CIM Macro for Floating-Point Edge Training and Inference connection using the 3rd-metal layer and connect the corresponding diagonal in the 4th layer; the row connection is in the 5th layer. This method circumvents the need for numerous MAC circuits and read ports as is the case for previous T-CIM works [7,8], resulting in a reduction in area and power consumption.
Yiyang Yuan1,2, Bingxin Zhang1,2, Yiming Yang3, Yishan Luo1,2, Qirui Chen3,
Shidong Lv3, Hao Wu1,2, Cailian Ma1,2, Ming Li1,2, Jinshan Yue1, Xinghua Wang3, Guozhong Xing1, Pui-In Mak4, Xiaoran Li3, Feng Zhang1 Figure 14.5.4 depicts the DCIM architecture supporting FP8, BF16, INT4, and INT8 forma
ISSCC 2025 Session 14 AI / ML
A 51.6TFLOPs/W Full-Datapath CIM Macro Approaching Sparsity Bound and <2-30 Loss for Compound AI
Zhiheng Yue*, Xujiang Xiang*, Yang Wang, Ruiqi Guo, Huiming Han,
with exceptional performance, but their prohibitive size and cost limits deployment on edge devices. The compound-AI combines several specialized small models to achieve matched or even superior accuracy on target downst
ISSCC 2025 Session 14 AI / ML
A 28nm 17.83-to-62.84TFLOPS/W Broadcast-Alignment Floating-Point CIM Macro with Non-Two’s-Complement MAC for CNNs and Transformers
Xing Wang*1,2, Tianhui Jiao*1, Yi Yang1, Shaochen Li1, Dongqi Li1, An Guo1,
Yuhui Shi1, Yuchen Tang1, Jinwu Chen1, Zhican Zhang1, Zhichao Liu1, Bo Liu1, Weiwei Shan1, Xin Wang3, Hao Cai1, Wenwu Zhu3, Jun Yang1,2, Xin Si1 Southeast University, Nanjing, China National Center of Technology Innovati
ISSCC 2025 Session 14 AI / ML
A 16nm 216kb, 188.4TOPS/W and 133.5TFLOPS/W Microscaling Multi-Mode Gain-Cell CIM Macro Edge-AI Devices loss of accuracy. In HV mode, the M2-IPU aligns INM based on both ∆PDE and ∆PDSS, with extra shifting in INM from ∆PDSS, which increases INM sparsity, further enhancing EEF. In phase 2 (Ph2), the OUT-PRO processes the activation function of the M2-CIM outputs and
generates INs for the next layer. In phase 3 (Ph3), the M2-IPU converts FP INs of the, subsequent layer to MX format. No
as the SS pre-processing circuit in Ph0, as the EXP processing circuit in Ph1, and as the FP2MX converter in Ph3. Win-San Khwa*1, Ping-Chun Wu*2, Jian-Wei Su2,3, Chiao-Yen Cheng2, Jun-Ming Hsu2, Yu-Chen Chen2, Le-Jung Hs
ISSCC 2025 Session 14 AI / ML
A 22nm 104.5TOPS/W µ-NMC-∆-IMC Heterogeneous STT-MRAM CIM Macro for Noise-Tolerant Bayesian Neural Networks
De-Qi You*1, Win-San Khwa*2, Bo Zhang3, Fang-Yi Chen1, Andrew Lee1,
Yu-Cheng Hung1, Yi-Ming Li1, Yu-Hui Wang1, Chung-Chuan Lo1, Ren-Shuo Liu1, Kea-Tiong Tang1, Chih-Cheng Hsieh1, Yu-Der Chih4, Tsung-Yung Jonathan Chang4, Meng-Fan Chang1,2 National Tsing Hua University, Hsinchu, Taiwan TS
ISSCC 2025 Session 13 AI / ML
An 8.62μW 75dB-DRSoC End-to-End Spoken-LanguageUnderstanding SoC with Channel-Level AGC and Temporal-Sparsity-Aware Streaming-Mode RNN
Sheng Zhou1, Zixiao Li1, Tobi Delbruck1, Kwantae Kim2, Shih-Chii Liu1
Aalto University, Espoo, Finland 1 Voice-controlled IoT nodes and wearable devices require integrated real-time ultra-lowpower audio classification circuits to perform tasks such as Keyword Spotting (KWS) and Spoken Lang
ISSCC 2025 Session 13 AI / ML
A 0.22mm2 161nW Noise-Robust Voice-Activity Detection Using Information-Aware Data Compression and Neuromorphic Spatial-Temporal Feature Extraction
Ying Liu*1, Jie Li*1, Qining Zhang*1, Tianhao Zhao2, Chenhao Shi1, Ninghui Shang1,
University, Hangzhou, China 3 Nano Core Chip Electronic Technology, Hangzhou, China 1 *Equally Credited Authors (ECAs) Nowadays, voice activation detection (VAD), typically consisting of the feature extractor (FE) and th
ISSCC 2024 Session 6 AI / ML
A 0.35V 0.367TOPS/W Image Sensor with 3-Layer Optical-Electronic Hybrid Convolutional Neural Network
Xuecheng Wang*, Zheng Huang*, Tianyi Liu, Wanxin Shi, Hongwei Chen, Milin Zhang
relies on image sensors coupled with cloud processing or on-chip Artificial Intelligence (AI) processors have encountered significant challenges in terms of power consumption, delays arising from data transmission, and/or
ISSCC 2024 Session 34 AI / ML
A Flash-SRAM-ADC-Fused Plastic Computing-in-Memory Macro for Learning in Neural Networks in a Standard 14nm FinFET Process
Linfang Wang1,2, Weizeng Li1,2, Zhidao Zhou1,2, Hanghang Gao1,2, Zhi Li1,2,
Wang Ye1,2, Hongyang Hu1, Jing Liu1, Jinshan Yue1, Jianguo Yang1, Qing Luo1, Chunmeng Dou1,2, Qi Liu1,3, Ming Liu1,3 Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China University of Chinese
ISSCC 2024 Session 34 AI / ML
A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Macro with 31.2TFLOPS/W for AI Edge Devices
Tai-Hao Wen*1, Hung-Hsi Hsu*1,2, Win-San Khwa*2, Wei-Hsing Huang1,
Zhao-En Ke1, Yu-Hsiang Chin1, Hua-Jin Wen1, Yu-Chen Chang1, Wei-Ting Hsu1, Chung-Chuan Lo1, Ren-Shuo Liu1, Chih-Cheng Hsieh1, Kea-Tiong Tang1, Shih-Hsin Teng3, Chung-Cheng Chou3, Yu-Der Chih3, Tsung-Yung Jonathan Chang3,
ISSCC 2024 Session 34 AI / ML
A 28nm 2.4Mb/mm2 6.9 - 16.3TOPS/mm2 eDRAM-LUT-Based Digital-Computing-in-Memory Macro with In-Memory Encoding and Refreshing
Yifan He1, Shupei Fan1, Xuan Li1, Luchang Lei1, Wenbin Jia1, Chen Tang1,
Yaolei Li1, Zongle Huang1, Zhike Du1, Jinshan Yue2, Xueqing Li1, Huazhong Yang1, Hongyang Jia1, Yongpan Liu1 Tsinghua University, Beijing, China Chinese Academy of Sciences, Beijing, China 1 2 Digital computing-in-memory
ISSCC 2024 Session 34 AI / ML
A 28nm 72.12TFLOPS/W Hybrid-Domain Outer-Product Based Floating-Point SRAM Computing-in-Memory Macro with Logarithm Bit-Width Residual ADC
Yiyang Yuan1,2, Yiming Yang3, Xinghua Wang3, Xiaoran Li3, Cailian Ma1,2,
Qirui Chen3, Meini Tang3, Xi Wei3, Zhixian Hou3, Jialiang Zhu1,2, Hao Wu1,2, Qirui Ren1,2, Guozhong Xing1, Pui-In Mak4, Feng Zhang1 Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China Univers
ISSCC 2024 Session 34 AI / ML
A 818-4094TOPS/W Capacitor-Reconfigured CIM Macro for Unified Acceleration of CNNs and Transformers Kentaro Yoshioka
Keio University, Yokohama, Japan
In the rapidly evolving landscape of machine learning, workloads using diverse neuralnetwork architectures must be covered: including CNNs for image processing, transformers for natural language processing (NLP), and hyb
ISSCC 2024 Session 34 AI / ML
A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-Digital Compute-in-Memory Macro Supporting INT12 × INT12 with a Parallel-MAC Architecture and Foundry 6T-SRAM Bit Cell
Hidehiro Fujiwara1, Haruki Mori1, Wei-Chang Zhao1, Kinshuk Khare1,
Cheng-En Lee1, Xiaochen Peng2, Vineet Joshi3, Chao-Kai Chuang1, Shu-Huan Hsu1, Takeshi Hashizume4, Toshiaki Naganuma4, Chen-Hung Tien1, Yao-Yi Liu1, Yen-Chien Lai1, Chia-Fu Lee1, Tan-Li Chou1, Kerem Akarvardar2, Saman Ad
ISSCC 2024 Session 34 AI / ML
A 22nm 64kb Lightning-Like Hybrid Computing-in-Memory Macro with a Compressed Adder Tree and Analog-Storage Quantizers for Transformer and CNNs
An Guo1, Xi Chen1, Fangyuan Dong1, Jinwu Chen1, Zhihang Yuan2,3, Xing Hu3,
Yuanpeng Zhang2, Jingmin Zhang1, Yuchen Tang1, Zhican Zhang1, Gang Chen3, Dawei Yang3, Zhaoyang Zhang1, Lizheng Ren1, Tianzhu Xiong1, Bo Wang1, Bo Liu1, Weiwei Shan1, Xinning Liu1, Hao Cai1, Guangyu Sun2, Jun Yang1, Xin
ISSCC 2024 Session 34 AI / ML
A 16nm 96Kb Integer/Floating-Point Dual-Mode-Gain-CellComputing-in-Memory Macro Achieving 73.3-163.3TOPS/W and 33.2-91.2TFLOPS/W for AI-Edge Devices
Win-San Khwa*1, Ping-Chun Wu*2, Jui-Jen Wu1, Jian-Wei Su2,3, Ho-Yu Chen2,
Zhao-En Ke2, Ting-Chien Chiu2, Jun-Ming Hsu2, Chiao-Yen Cheng2, Yu-Chen Chen2, Chung-Chuan Lo2, Ren-Shuo Liu2, Chih-Cheng Hsieh2, Kea-Tiong Tang2, Meng-Fan Chang1,2 TSMC Corporate Research, Hsinchu, Taiwan National Tsing
ISSCC 2024 Session 34 AI / ML
A 28nm 83.23TFLOPS/W POSIT-Based Compute-in-Memory Macro for High-Accuracy AI Applications and denotes early 01 or 10 change. It uses XOR and a leading-one detector if RA/RB with different signs. BRPU reduces the regime processing energy by 68%.
Yang Wang1, Xiaolong Yang1, Yubin Qin1, Zhiren Zhao1, Ruiqi Guo1,
Zhiheng Yue1, Huiming Han1, Shaojun Wei1, Yang Hu1, Shouyi Yin1,2 Figure 34.1.4 depicts the CPCS, increasing the CIM array utilization. The CPCS CIM core consists of an 8×48 CIM array, a load controller, a critical-bit c
ISSCC 2024 Session 33 AI / ML
A Miniature Neural Interface Implant with a 95% Charging Efficiency Optical Stimulator and an 81.9dB SNDR ΔΣM-Based Recording Frontend
Linran Zhao1, Wei Shi2, Yan Gong3, Xiang Liu3, Wen Li3, Yaoyao Jia1
Meta, Santa Clara, CA 3 Michigan State University, East Lansing, MI 1 2 Neural interface implants are revolutionizing neuroscience research, especially in brainmachine interfaces and neuromodulation therapies. Miniaturiz
ISSCC 2024 Session 33 AI / ML
A Two-Electrode Bio-Impedance Readout IC with ComplexDomain Noise-Correlated Baseline Cancellation Supporting Sinusoidal Excitation
Song-I Cheon*1, Haidam Choi*1, Gichan Yun1, Sein Oh1, Ji-Hoon Suh1,
As the demand for daily monitoring of physiological signals increases, the trend towards minimizing the size of devices through a two-electrode configuration has emerged as a new standard for wearable impedance monitoring
ISSCC 2024 Session 33 AI / ML
An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction
Jeonghoon Cho*, You Jang Pyeon*, Junyeong Yeom*, Hyunjoong Kim*,
Sanghyeon Cho, Yonggi Kim, Taejung Kim, Jong-Hyun Kwak, Geonjun Choi, Yoonsik Lee, Heungjoo Shin, Hoon Eui Jeong, Jae Joon Kim Ulsan National Institute of Science and Technology, Ulsan, Korea *Equally Credited Authors (E
ISSCC 2024 Session 33 AI / ML
A Millimetric Batteryless Biosensing and Stimulating Implant with Magnetoelectric Power Transfer and 0.9pJ/b PWM Backscatter
Zhanghao Yu*, Huan-Cheng Liao*, Fatima Alrashdan, Ziyuan Wen, Yiwei Zou,
Joshua Woods, Wei Wang, Jacob T. Robinson, Kaiyuan Yang Rice University, Houston, TX *Equally Credited Authors (ECAs) Bioelectronic implants transform clinical therapies by offering unprecedented tools for precise sensin
ISSCC 2024 Session 33 AI / ML
Closed-Loop 100-Channel Highly-Scalable Retinal Implant with 1.02μW Analog ED-Based Adaptive-Threshold Spike Detection and Poisson-Coded Temporally Distributed Optogenetic Stimulation
Tayebeh Yousefi, Georg Zoidl, Hossein Kassiri
Intraocular stimulators have demonstrated promise in treating patients with retinal degeneration (e.g., age-related macular degeneration) by restoring visual input to the compromised retina. This is done by capturing ima
ISSCC 2024 Session 33 AI / ML
A Multi-Loop Neuromodulation Chipset Network with Frequency-Interleaving Front-End and Explainable AI for Memory Studies in Freely Behaving Monkeys
Yuhan Hou1, Yi Zhu1, Xiao Wu1, Yinfei Li1, Timothy Lucas2, Andrew Richardson3, Xilin Liu1
of dementia, affects over 30 million people worldwide and accounts for more than 1% of the global GDP [1]. Given that age is a significant risk factor, the number of AD patients is projected to double in the next two deca
ISSCC 2024 Session 33 AI / ML
MiBMI: A 192/512-Channel 2.46mm2 Miniaturized Brain-Machine Interface Chipset Enabling 31-Class Brain-to-Text Conversion Through Distinctive Neural Codes
Mohammad Ali Shaeri1,2, Uisub Shin1,2,3, Amitabh Yadav1,2,
Fribourg, Switzerland 1 2 Recently, cutting-edge brain-machine interfaces (BMIs) have revealed the potential of decoders such as recurrent neural networks (RNNs) in predicting attempted handwriting
ISSCC 2024 Session 33 AI / ML
A Sub-1µJ/class Headset-Integrated Mind Imagery and Control SoC for VR/MR Applications with Teacher-Student CNN and General-Purpose Instruction Set Architecture
Zhiwei Zhong*, Yijie Wei*, Lance Christopher Go, Jie Gu
*Equally Credited Authors (ECAs) Virtual Reality (VR) and Mixed Reality (MR) systems, e.g., Meta Quest and Apple Vision Pro, have recently gained significant interest in consumer electronics, creating a new wave of develo
ISSCC 2024 Session 33 AI / ML
A Hybrid Recording System with 10kHz-BW 630mVPP 84.6dB-SNDR 173.3dB-FOMSNDR and 5kHz-BW 114dB-DR for Simultaneous ExG and Biocurrent Acquisition
Taeryoung Seol, Geunha Kim, Sehwan Lee, Samhwan Kim, Dongwook Kim,
Jeongyoon Wie, Yeonjae Shin, Hongki Kang, Jae Eun Jang, Arup K. George, Junghyup Lee Daegu Gyeongbuk Institute of Science and Technology, Daegu, Korea As the precise acquisition of continuous ExG (ENG, ECG, etc.) and bio
ISSCC 2024 Session 33 AI / ML
A 2.7ps-ToF-Resolution and 12.5mW Frequency-domain NIRS Readout IC with Dynamic Light Sensing Frontend and Cross-Coupling-Free Inter-Stabilized Data Converter
Zhouchen Ma1, Yuxiang Lin1, Cheng Chen1, Xiang’ao Qi1, Yongfu Li1,
United Imaging Microelectronics Technology, Shanghai, China 4 Shanghai Mental Health Center, Shanghai, China 1 2 The non-invasive quantification of metabolite concentration is of significant importance in the fields of medi
ISSCC 2024 Session 33 AI / ML
A High-Accuracy and Energy-Efficient Zero-Shot-Retraining Seizure-Detection Processor with Hybrid-Feature-Driven Adaptive Processing and Learning-Based Adaptive Channel Selection
Jiahao Liu1, Xiao Liu1, Xu Wang1, Ziyi Xie1, Zirui Zhong1, Jiajing Fan1, Hui Qiu1,
Yiming Xu1, Huajing Qin1, Yu Long1, Yuhong Zhou2, Zixuan Shen3, Liang Zhou1, Liang Chang1, Shanshan Liu1, Shuisheng Lin1, Chao Wang3, Jun Zhou1 University of Electronic Science and Technology of China, Chengdu, China Wes
ISSCC 2024 Session 32 AI / ML
An Ultra-Compact 28GHz Doherty Power Amplifier with an Asymmetrically-Coupled-Transformer Output Combiner
Edward Liu1,2, Hua Wang1
Georgia Institute of Technology, Atlanta, GA 1 2 Mm-wave wireless communication and sensing heavily rely on phased arrays to compensate for high path losses and meet link-budget targets. Recent mm-wave arrays have grown
ISSCC 2024 Session 30 AI / ML
Vecim: A 289.13GOPS/W RISC-V Vector Co-Processor with Compute-in-Memory Vector Register File for Efficient High-Performance Computing
Yipeng Wang, Mengtian Yang, Chieh-pu Lo, Jaydeep P. Kulkarni
Vector processors have re-emerged in high-performance computing and flagship mobile SoC designs for their improved programmability, appealing power efficiency over multicore processors and area efficiency over GPUs [1]. For
ISSCC 2024 Session 30 AI / ML
A 22nm 0.26nW/Synapse Spike-Driven Spiking Neural Network Processing Unit Using Time-Step-First Dataflow and Sparsity-Adaptive In-Memory Computing
Ying Liu*1, Yufei Ma*1, Ninghui Shang1, Tianhao Zhao2, Peiyu Chen1, Meng Wu1,
Science and Technology University, Beijing, China *Equally Credited Authors (ECA) 1 2 Recently, brain-inspired spiking neural networks (SNNs) have demonstrated tremendous improvement in energy efficiency (EE) and low powe
ISSCC 2024 Session 20 AI / ML
Space-Mate: A 303.5mW Real-Time Sparse Mixture-ofExperts-Based NeRF-SLAM Processor for Mobile Spatial Computing
Gwangtae Park1, Seokchan Song1, Haoyang Sang1, Dongseok Im1,
Recently, spatial computing has become popular in mobile devices, such as autonomous robots and augmented reality (AR) glasses [1], and it enables cyber-physical interaction through accurate user position and 3D geometri
ISSCC 2024 Session 20 AI / ML
NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with SegmentedHashing Architecture
Junha Ryu1, Hankyul Kwon1, Wonhoon Park1, Zhiyong Li1, Beomseok Kwon1,
Cambridge, MA 1 2 With the rise of the metaverse, there’s a growing demand for 3D modeling and rendering technologies that can bring real-world objects/scenes into the augmented/virtual world on mobile devices. Recently,
ISSCC 2024 Session 20 AI / ML
LSPU: A Fully Integrated Real-Time LiDAR-SLAM SoC with Point-Neural-Network Segmentation and Multi-Level kNN Acceleration
Jueun Jung1, Seungbin Kim1, Bokyoung Seo1, Wuyoung Jang1, Sangho Lee1,
mobile robots require Simultaneous Localization and Mapping (SLAM) for autonomous driving and seamless interaction with the surrounding objects. Previous RGB-based visual SLAM processors [1-2] cannot be deployed for auto
ISSCC 2024 Session 20 AI / ML
C-Transformer: A 2.6-18.1μJ/Token Homogeneous DNN-Transformer/Spiking-Transformer Processor with Big-Little Network and Implicit Weight Generation for Large Language Models
Sangyeob Kim, Sangjin Kim, Wooyoung Jo, Soyeon Kim, Seongyon Hong, Hoi-Jun Yoo
20.5.1, are widely used, and even on-device LLM systems with real-time responses are anticipated
ISSCC 2024 Session 20 AI / ML
A 28nm Physics Computing Unit Supporting Emerging Physics-Informed Neural Network and Finite Element Method for Real-Time Scientific Computing on Edge Devices
Yuhao Ju, Ganqi Xu, Jie Gu
The demand for real-time computing on edge devices from emerging applications, e.g. AI, has exploded in recent years. Lately, physics-based scientific computing has also drawn significant interests driven by the growth of
ISSCC 2024 Session 20 AI / ML
A 23.9TOPS/W @ 0.8V, 130TOPS AI Accelerator with 16× Performance-Accelerable Pruning in 14nm Heterogeneous Embedded MPU for Real-Time Robot Applications
Koichi Nose, Taro Fujii, Katsumi Togawa, Shunsuke Okumura, Kentaro Mikami,
expectations for the advancement of human-cooperative robots. In such robots, advanced environmental recognition (mainly AI based), planning and control (normally non-AI algorithms) have to be processed simultaneously in
ISSCC 2024 Session 20 AI / ML
A 28nm 74.34TFLOPS/W BF16 Heterogenous CIM-Based Accelerator Exploiting Denoising-Similarity for Diffusion Models
Ruiqi Guo1, Lei Wang1, Xiaofeng Chen1, Hao Sun1, Zhiheng Yue1, Yubin Qin1,
China 3 Shanghai AI Lab, Shanghai, China 1 2 Diffusion models (DMs) have emerged as a powerful category of generative models with record-breaking performance in image synthesis [1]. A noisy image created from pure Gaussi
ISSCC 2024 Session 20 AI / ML
NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices
Ming-En Shih*1, Shih-Wei Hsieh*1, Ping-Yuan Tsai*1, Ming-Hung Lin1,
Pei-Kuei Tsung1, En-Jui Chang1, Jenwei Liang1, Shu-Hsin Chang1, Chung-Lun Huang1, You-Yu Nian1, Zhe Wan2, Sushil Kumar2, Cheng-Xin Xue1, Gajanan Jedhe2, Hidehiro Fujiwara3, Haruki Mori3, Chih-Wei Chen1, Po-Hua Huang1, Ch
ISSCC 2024 Session 11 AI / ML
IBM NorthPole: An Architecture for Neural Network Inference with a 12nm Chip
Andrew S. Cassidy, John V. Arthur, Filipp Akopyan, Alexander Andreopoulos,
Rathinakumar Appuswamy, Pallab Datta, Michael V. Debole, Steven K. Esser, Carlos Ortega Otero, Jun Sawada, Brian Taba, Arnon Amir, Deepika Bablani, Peter J. Carlson, Myron D. Flickner, Rajamohan Gandhasri, Guillaume J. G
ISSCC 2023 Session 9 AI / ML
A 1mW Always-on Computer Vision Deep Learning Neural Decision Processor
David Garrett, Youn Sung Park, Seongjong Kim, Jay Sharma, Wenbin Huang,
Majid Shaghaghi, Vinay Parthasarathy, Stephen Gibellini, Stephen Bailey, Mallik Moturi, Pieter Vorenkamp, Kurt Busch, Jeremy Holleman, Behrooz Javid, Alireza Yousefi, Mohsen Judy, Atul Gupta Syntiant, Irvine, CA Syntiant
ISSCC 2023 Session 7 AI / ML
CTLE-Ising: A 1440-Spin Continuous-Time Latch-Based Ising Machine with One-Shot Fully-Parallel Spin Updates Featuring Equalization of Spin States
Jooyoung Bae*, Wonsik Oh*, Jahyun Koo, Bongjin Kim
*Equally Credited Authors (ECAs) The Ising machine is a hardware accelerator that finds solutions to combinatorial optimization problems (COPs) using the natural convergence behavior of the Ising model, which comprises a
ISSCC 2023 Session 7 AI / ML
A 22nm Delta-Sigma Computing-In-Memory (∆ΣCIM) SRAM Macro with Near-Zero-Mean Outputs and LSB-First ADCs Achieving 21.38TOPS/W for 8b-MAC Edge AI Processing
Peiyu Chen*1, Meng Wu*1, Wentao Zhao1, Jiajia Cui1, Zhixuan Wang1,2,
Peking University, Hangzhou, China, 3 Nano Core Chip Electronic Technology, Hangzhou, China *Equally Credited Authors (ECAs) 1 2 In AI-edge devices, the changes of input features are normally progressive or occasional, e
ISSCC 2023 Session 7 AI / ML
CV-CIM: A 28nm XOR-Derived Similarity-Aware Computation-in-Memory for Cost-Volume Construction
Zhiheng Yue, Yang Wang, Huizheng Wang, Yabing Wang, Ruiqi Guo,
pixels in paired images, is a fundamental kernel of stereo vision processing and has been directly used in robotic, autopilot, and AR/VR applications. However, the large parameter size and consecutive data accesses of re
ISSCC 2023 Session 7 AI / ML
A 70.85–86.27TOPS/W PVT-Insensitive 8b Word-Wise ACIM with Post-Processing Relaxation
end of the compute phase, the converted voltage (V8bink = Dink[7:0] × VREF /(16 × 17)) is, buffered into the SRAM array
the 16× reduction of the global VREF routing (from 8b 256 nodes to 16 nodes), the area is 16× smaller. Without the multi-conversions of MSB/LSB parts and digital bit shifting, the clock complexity, gain, offset, linearit
ISSCC 2023 Session 7 AI / ML
A 28nm Horizontal-Weight-Shift and Vertical-Feature-ShiftBased Separate-WL 6T-SRAM Computation-in-Memory Unit-Macro for Edge Depthwise Neural-Networks
Bo Wang, Chen Xue, Zhongyuan Feng, Zhaoyang Zhang, Han Liu, Lizheng Ren,
Xiang Li, Anran Yin, Tianzhu Xiong, Yeyang Xue, Shengnan He, Yuyao Kong, Yongliang Zhou, An Guo, Xin Si, Jun Yang Southeast University, Nanjing, China SRAM-based computation-in-memory (CIM) has shown great potential in i
ISSCC 2023 Session 7 AI / ML
A 4nm 6163-TOPS/W/b 4790-TOPS/mm2/b SRAM Based Digital-Computing-in-Memory Macro Supporting Bit-Width Flexibility and Simultaneous MAC and Weight Update disabled, to save power, in 8b mode. The INWIDTH[1:0] bus controls the XIN width: 00 for 8b, 01 for 12b, and 10 for 16b modes. To support a signed format with width flexibility, the first 4 cycles are signed 4b operations and the rest of the cycles are unsigned 4b operations, regardless of INWIDTH.
Haruki Mori1, Wei-Chang Zhao1, Cheng-En Lee1, Chia-Fu Lee1, Yu-Hao Hsu1,
Chao-Kai Chuang1, Takeshi Hashizume2, Hao-Chun Tung1, Yao-Yi Liu1, Shin-Rung Wu1, Kerem Akarvardar3, Tan-Li Chou1, Hidehiro Fujiwara1, Yih Wang1, Yu-Der Chih1, Yen-Huei Chen1, Hung-Jen Liao1, Tsung-Yung Jonathan Chang1 F
ISSCC 2023 Session 7 AI / ML
A 28nm 38-to-102-TOPS/W 8b Multiply-Less Approximate Digital SRAM Compute-In-Memory Macro for Neural-Network Inference
Yifan He1, Haikang Diao2, Chen Tang1, Wenbin Jia1, Xiyuan Tang2, Yuan Wang2,
2 This paper presents a 2-to-8-b scalable digital SRAM-based CIM macro that is codesigned with a multiply-less neural-network (NN) design methodology and incorporates dynamic-logic-based approximate circuits for vector-v
ISSCC 2023 Session 7 AI / ML
A 28nm 64-kb 31.6-TFLOPS/W Digital-Domain Floating-PointComputing-Unit and Double-Bit 6T-SRAM Computing-inMemory Macro for Floating-Point CNNs
An Guo, Xin Si, Xi Chen, Fangyuan Dong, Xingyu Pu, Dongqi Li,
Yongliang Zhou, Lizheng Ren, Yeyang Xue, Xueshan Dong, Hui Gao, Yiran Zhang, Jingmin Zhang, Yuyao Kong, Tianzhu Xiong, Bo Wang, Hao Cai, Weiwei Shan, Jun Yang Southeast University, Nanjing, China SRAM-based computing-in-
ISSCC 2023 Session 7 AI / ML
A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Compute Macro with 16.2-70.2TFLOPS/W for High-Accuracy AI-Edge Devices
Ping-Chun Wu*1, Jian-Wei Su*1,2, Li-Yang Hong1, Jin-Sheng Ren1,
Chih-Han Chien1, Ho-Yu Chen1, Chao-En Ke1, Hsu-Ming Hsiao2, Sih-Han Li2, Shyh-Shyuan Sheu2, Wei-Chung Lo2, Shih-Chieh Chang2, Chung-Chuan Lo1, Ren-Shuo Liu1, Chih-Cheng Hsieh1, Kea-Tiong Tang1, Meng-fan Chang1 National T