Other

Tzu-Chien Hsueh1, Tawfiq Musah1, Gokce Keskin1, Sudip Shekhar1,*, Joseph Kennedy1, Shreyas Sen1, Rajesh Inti1, Mozhgan Mansuri1, Michael Leddige1, Bryce Horine1, Clark Roberts1, Randy Mooney2, Bryan Casper1 Intel, Hillsb

Sanjeev Maheswari, Ratnakar Dadi, Arif Amin, Gautam Bhatia, Peter Mills, Ahmed Ragab, Edward Lee nVidia, Santa Clara, CA As the processing power and clock rate of CPUs and GPUs increase, there is a need for increased I/O

area, delay, and power consumption of FPGAs relative to ASICs. In [1] it is estimated that a 3D-FPGA with the configuration memory stacked on top of the FPGA logic and routing can achieve 57% smaller die area than a base

Field-Effect Transistors)

applications such as smart buildings, medical implants, and surveillance systems. However, existing devices are bulky, measuring >1cm3, and they are hampered by short lifetimes and fail to realize the “smart dust” vision

Bucknell Webb2, Lubomyr Romankiw2, Michele Petracca1, Ryan Davies1, Robert Fontana3, Gary Decad3, Ioannis Kymissis1, Angel Peterchev4, Luca Carloni1, William Gallagher2, Kenneth Shepard1 1 3 Columbia University, New York

progressing from MicroElectroMechanical Systems to NanoElectroMechanical Systems (NEMS). Indeed, NEMS are emerging as a new field of interest because their submicron dimensions make them converge towards CMOS fabrication

readout circuit forms the necessary ingredients of a new generation of electronic nose (e-nose) devices that, owing to their form factor and power consumption, enable a range of novel applications. Using “application spe

Sandeep D’Souza1, Ning-Yi Wang1, Hao Wu1, Yen-Hsiang Wang1, Mandy Tang1, Gabriel Virbila1, Mike Pham1, Derek Yang1, Qun Jane Gu2, Yi-Cheng Wu1, Yen-Cheng Kuan1, Charles Chien3, Mau-Chung Frank Chang1 University of Califo

Bas Van der Putten3, Edsger Smits3, Soeren Steudel2, Karin Tempelaars3, Ashutosh Tripathi3, Gerwin Gelinck3, Arthur Van Roermund1, Eugenio Cantatore1 Eindhoven University of Technology, Eindhoven, The Netherlands imec, L

Jürgen Steiger3, Silviu Botnaras3, Dennis Weber3, Bernhard Herold4, Jürgen Ficker4, Bas van der Putten5, Gerwin Gelinck5, Jan Genoe1,6, Wim Dehaene1,2, Paul Heremans1,2 imec, Leuven, Belgium KU Leuven, Leuven, Belgium 3

technologies are rapidly gaining performance and quality. Several prototypes of flexible display devices have been presented and the market breakthrough of such devices is expected shortly. Besides flexible display appli

Yasuhiro Shinozuka1, Hiroshi Fuketa1, Tomoyuki Yokota1, Ute Zschieschang2, Hagen Klauk2, Gregory Tortissier1, Tsuyoshi Sekitani1,3, Makoto Takamiya1, Hiroshi Toshiyoshi1, Takao Someya1,3, Takayasu Sakurai1 University of

One of the remaining challenges in implementing CMOS 60GHz radios is to cover longer communication distance as the high path loss at mm-Wave frequencies demands higher EIRP, which in turn requires considerable design eff

Samsung Electro-Mechanics, Atlanta, GA Although Si CMOS PAs for mobile applications have demonstrated specificationcompliant performance over the last several years, Si CMOS has not been widely employed in cellular PA ap

Wireless high-speed communication standards such as WiFi, WiMax and LTE use spectrally-efficient OFDM modulation that encodes signal information in both amplitude and phase. Use of this non-constant envelope modulation r

digital devices such as cameras, media players and high-definition TVs has seen a significant growth. This requires tuners for home networking such as MoCA with increasingly large bandwidth. Though advanced CMOS technolo

Romain Gwoziecki1, Isabelle Chartier1, Romain Coppard1, Christophe Serbutoviez1, Lidia Maddiona2, Enzo Fontana2, Antonino Scuderi2 1 CEA-LITEN, Grenoble, France, STMicroelectronics, Catania, Italy 2 Drastic efforts have

C. Daniel Frisbie1, Chris H. Kim1 1 2 University of Minnesota, Minneapolis, MN, Optomec, St. Paul, MN Organic thin-film-transistors (OTFTs) are drawing much attention as they have attributes such as structural flexibilit

Florian Letzkus1, Harald Richter1, Hagen Klauk3, Joachim N. Burghartz1,2 1 Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany, University of Stuttgart, Stuttgart, Germany, 3 Max Planck Institute for

Eindhoven, The Netherlands, 5 KHLim, Diepenbeek, Belgium 3 We introduce a microprocessor made by organic thin-film transistors processed directly onto flexible plastic foil. This is a direct realization of a microprocess

2 Columbia University, New York, NY, CEA-LETI-MINATEC, Grenoble, France GHz-range applications that operate in a variety of signal situations and/or multiple standards require highly programmable responses that cannot be

nonfunctional devices early in the fabrication process. It is commonly performed by placing a probe card directly above a device under test (DUT) and establishing a mechanical contact between them by means of an array of

Toshitsugu Sakamoto1, Koichiro Okamoto1, Naoki Banno1, Shinji Ishida1, Kimihiko Ito1, Hiromitsu Hada1, Noboru Sakimura1, Tadahiko Sugibayashi1, Masato Motomura2 1 NEC, Sagamihara, Japan, NEC, Kawasaki, Japan 2 Programmab

zero emissions of carbon dioxide, wake-up circuits have attracted attention as a promising approach for reducing standby power [1]. The dominant consumers of standby power are household electric appliances driven by AC p

mmWave imaging systems can be improved by an increase of their operating frequencies into the submillimeterwave range (300GHz to 3THz). Electronic terahertz sources and receivers are presently dominated by III/V semicond

Joris Van Campenhout, Min Yang, Fuad Doany, Solomon Assefa, Christopher Jahnes, Jeffrey Kash, Yurii Vlasov IBM T. J. Watson Reseach Center, Yorktown Heights, NY The emerging field of silicon photonics [1-3] targets monol

are expected to be key to the achievement of an upgraded energy infrastructure, such as Smart Grid. While EMS may offer monitoring, reporting, and control of energy usage, these functions simply track intermittently the

Tsuyoshi Sekitani1, Hiroyoshi Nakajima2, Hiroki Maeda2, Makoto Takamiya1, Takao Someya1, Takayasu Sakurai1 1 University of Tokyo, Tokyo, Japan, Dai Nippon Printing, Chiba, Japan 2 A smart meter is essential for realizing

Yokohama, Japan 2 Harvesting energy from the environment by using a thermoelectric generator (TEG) or photovoltaic cells provides a solution for battery-free sensor networks or electronic healthcare systems. In these sys

Hossein Fariborzi1, Abhinav Gupta2, Hei Kam2, Vincent Pott2, Jaeseok Jeon2, Tsu-Jae King Liu2, Dejan Markovic3, Vladimir Stojanovic1, Elad Alon2 Massachusetts Institute of Technology, Cambridge, MA, University of Califor

Herman Oprins1, Cristina Torregiani1, Steven Thijs1, Dimitri Linten1, Michele Stucchi1, Katti Guruprasad1, Dimitrios Velenis1, Domae Shinichi2, Vladimir Cherman1, Bart Vandevelde1, Veerle Simons1, Ingrid De Wolf1, Riet L

implemented for monolithic integrated System on Chip (SoC) by applying the advantages of process compatibility between MEMS and CMOS LSI [1]. However, it has been impossible to integrate them in the case that MEMS and st

Hideki Kusamitsu1, Yoshio Komoto1, Kunihiko Iizuka1, Katsuyuki Ikeuchi2, Gil Su Kim2, Makoto Takamiya2, Takayasu Sakurai2 1 Association of Super-Advanced Electronics Technologies, Yokohama, Japan University of Tokyo, Tok

Akintunde I. Akinwande, Vladimir Bulovic, Charles G. Sodini Massachusetts Institute of Technology, Cambridge, MA Traditionally, several technologies have been used for temperature sensing, including integrated silicon ΔV

Gerwin H. Gelinck4, Jan Genoe1,5, Wim Dehaene1,2, Paul Heremans1,2 IMEC, Leuven, Belgium, K.U. Leuven, Leuven, Belgium, 3 Polymer Vision, Eindhoven, Netherlands, 4 TNO Science and Industry, Eindhoven, Netherlands, 5 Kath

Shigeki Shino2, Ute Zschieschang3, Hagen Klauk3, Makoto Takamiya1, Takao Someya1, Takayasu Sakurai1 1 University of Tokyo, Tokyo, Japan Mitsubishi Paper Mills, Kyoto, Japan 3 Max Planck Institute for Solid-State Research

K.U. Leuven, Leuven, Belgium Polymer Vision, Eindhoven, Netherlands 3 IMEC, Heverlee, Belgium 2 Organic electronics is expected to find commercial applications in flexible displays, RFID tags and smart sensor systems, e.

Pranita Kulkarni1, Jeffrey W. Sleight3, Davood Shahrjerdi3, Josephine B. Chang3, Sungjae Lee4, Junjun Li4, Huiming Bu1, Robert Gauthier4, Bruce Doris1, Ghavam Shahidi3 1 IBM, Albany, NY, IBM, Hopewell Junction, NY, IBM T

electronics that can mechanically flex, span large areas, and integrate with polymeric materials. Potential applications include flexible displays, biochemical sensors, and artificial skin. In many applications, OTFTs ac

Yoshinori Kohama1, Kazutaka Kasuga1, Itaru Nonomura2, Makoto Saen3, Shigenobu Komatsu3, Kenichi Osada3, Naohiko Irie3, Toshihiro Hattori2, Atsushi Hasegawa2, Tadahiro Kuroda1 1 Keio University, Yohohama, Japan 2 Renesas

Media processors that can be applied to vehicle or robot vision have been developed previously [1]. However, even using the latest media processors, the ability of artificial vision is far below that of human vision. All

Nishimura, Kazumasa Tanida, Kazutaka Akiyama, Masahiro Sekiguchi, Mie Matsuo, Satoru Fukuchi, Katsutomu Takahashi Toshiba Semiconductor, Yokohama, Japan No one doubts that Through Silicon Via (TSV) is one of the necessar

field-coupled single-domain magnets is promising for rad-hard, nonvolatile, dense and highly parallel digital information processing. The shortcomings of metal wiring are overcome as no current flow is needed for the log

Koichi Ishida1, Naoki Masunaga1, Zhiwei Zhou1, Tadashi Yasufuku1, Tsuyoshi Sekitani1, Ute Zschieschang2, Hagen Klauk2, Makoto Takamiya1, Takao Someya1, Takayasu Sakurai1 1 University of Tokyo, Tokyo, Japan Max Planck Ins

increased each year; the test cost especially for low-price IC chips, for example, exceeds one-third of total chip cost. Furthermore, screening test on wafer to select good dies (KnownGood-Die) will become more significa

to many-core will drive increased chip-to-chip I/O bandwidth demands at processor/memory interfaces and in multi-processor systems. Future architectures will require bandwidths of 200GB/s to 1.0TB/s and will bring about

many consumer applications such as television and home-theatre systems. The high efficiency of Class-D amplifiers allows for providing a very high output power with a modest heat sinking. The audio amplifier market has a

The high efficiency of Class-D amplifiers (CDAs) makes them highly attractive candidates for audio drivers in systems with extremely low-power requirements. However, to achieve low distortion, the audio modulator is usua

Due to their rail-to-rail switching nature, Class-D audio amplifiers are prone to generating electromagnetic interference (EMI) that is in excess of what is acceptable in many systems. Such systems typically require devi