技术领域

Sensors

100 篇相关论文 (2008–2026)

ISSCC 2014 Session 12 Sensors
3D Ultrasonic Gesture Recognition
Richard J. Przybyla1, Hao-Yen Tang1, Stefon E. Shelton2,
David A. Horsley2, Bernhard E. Boser1 University of California, Berkeley, CA, 2University of California, Davis, CA 1 Optical 3D imagers for gesture recognition suffer from large size and high power consumption. Their per
ISSCC 2013 Session 22 Sensors
3D Volumetric Ultrasound Imaging with a 32×32 CMUT Array Integrated with Front-End ICs Using Flip-Chip Bonding Technology
Anshuman Bhuyan1, Jung Woo Choe1, Byung Chul Lee1, Ira Wygant2,
Amin Nikoozadeh1, Omer Oralkan3, Butrus T. Khuri-Yakub1 Stanford University, Stanford, CA, Texas Instruments, Santa Clara, CA, 3 North Carolina State University, Raleigh, NC 1 2 3D ultrasound imaging is becoming increasi
ISSCC 2013 Session 22 Sensors
A [10°C ; 70°C] 640×480 17μm Pixel Pitch TEC-Less IR Bolometer Imager with Below 50mK and Below 4V Power Supply
The CTIA’s gain can be set between 5 and 70V/μA. At 30°C, such a high gain, allows for an output NETD that is only 2% hi
bolometer’s NETD. Bertrand Dupont, Antoine Dupret, Sebastien Becker, Antoine Hamelin, Fabrice Guellec, Pierre Imperinetti, Wilfried Rabaud To compensate for the remaining FPN, offset pre-correction (OPC) is implemented:
ISSCC 2013 Session 22 Sensors
A 5.6mV Inter-Channel DVO 10b Column-Driver IC with Mismatch-Free Switched-Capacitor Interpolation for Mobile Active-Matrix LCDs
Hyun-Sik Kim, Jun-Hyeok Yang, Sang-Hui Park, Seung-Tak Ryu, Gyu-Hyeong Cho
resolution and good channel-to-channel uniformity are required in column-driver ICs. In conventional column-driver ICs, the resistor-DAC (R-DAC) architecture has been generally used due to its uniform characteristic, bec
ISSCC 2013 Session 22 Sensors
A Highly Noise-Immune Touch Controller Using Filtered-Delta-Integration and a Charge-Interpolation Technique for 10.1-inch Capacitive Touch-Screen Panels
Jun-Hyeok Yang1, Sang-Hui Park1, Jung-Min Choi2, Hyun-Sik Kim1,
mobile products on the basis of their high quality of touch features, as well as superior visibility and durability [1-5]. Capacitive TSPs can be classified into selfcapacitance [1,2] or mutual-capacitance [3-5] types, a
ISSCC 2013 Session 22 Sensors
A 55dB SNR with 240Hz Frame Scan Rate Mutual Capacitor 30×24 Touch-Screen Panel Read-Out IC Using Code-Division Multiple Sensing Technique
Hyungcheol Shin1, Seunghoon Ko1, Hongjae Jang1, Ilhyun Yun2, Kwyro Lee1
interfaces, such as multi-touch, pinch zoom-in/out gestures, thus expanding the smartphone market. However, capacitive touch-screen technology still suffers from performance degradation like a low frame scan rate and poo
ISSCC 2013 Session 22 Sensors
A Micropower Battery Current Sensor with ±0.03% (3σ) Inaccuracy from -40 to +85°C
Saleh Heidary Shalmany1, Dieter Draxelmayr2, Kofi A.A. Makinwa1
Infineon Technologies, Villach, Austria 1 2 This paper presents a micropower current-sensing system (CSS) for battery monitoring, which consists of a calibrated shunt resistor, a ΔΣ ADC, and a dynamic bandgap reference (
ISSCC 2013 Session 22 Sensors
A 0.5V <4μW CMOS Photoplethysmographic Heart-Rate Sensor IC Based on a Non-Uniform Quantizer
Mohammad Alhawari1,2, Nadya Albelooshi1, Michael H. Perrott1
Now at Khalifa University, Abu Dhabi, United Arab Emirates 1 2 Photoplethysmographic biosensing has been of recent interest, since it provides electrode-free operation for continuous health-monitoring applications [1]. T
ISSCC 2013 Session 22 Sensors
A 0.25mm2 AC-Biased MEMS Microphone Interface with 58dBA SNR
Selcuk Ersoy1, Robert H.M. van Veldhoven1, Fabio Sebastiano1,
Klaus Reimann1, Kofi A.A. Makinwa2 NXP Semiconductors, Eindhoven, The Netherlands, Delft University of Technology, Delft, The Netherlands 1 On-chip capacitors C1,2,3 must be trimmed to Cm to maximize carrier suppression
ISSCC 2013 Session 22 Sensors
A Fully Differential Charge-Balanced Accelerometer for Electronic Stability Control
Vladimir P Petkov1, Ganesh K Balachandran1, Jochen Beintner2
in a broad range of vehicles [1]. The demand for lower cost and higher integration continues to increase the performance requirements for many of the system’s components. In particular, the trend towards placing the Iner
ISSCC 2012 Session 11 Sensors
Ratiometric BJT-Based Thermal Sensor in 32nm and 22nm Technologies
Joseph Shor, Kosta Luria, Dror Zilberman
Thermal sensors are used in modern microprocessors to provide information for: 1) throttling at the maximum temperature of operation, and 2) fan regulation at temperatures down to 50°C. Today’s microprocessors are therma
ISSCC 2012 Session 11 Sensors
A CMOS Temperature Sensor with a VoltageCalibrated Inaccuracy of ±0.15°C (3σ) From -55 to 125°C
Kamran Souri, Youngcheol Chae, Kofi Makinwa
This paper describes an energy-efficient CMOS temperature sensor intended for use in RFID tags. The sensor achieves an inaccuracy of ±0.15°C (3σ) over the military temperature range (-55 to 125°C) and dissipates only 27n
ISSCC 2012 Session 11 Sensors
A Temperature-to-Digital Converter for a MEMSBased Programmable Oscillator with Better Than ±0.5ppm Frequency Stability
Michael Perrott1, Jim Salvia2, Fred Lee3, Aaron Partridge2,
Shouvik Mukherjee2, Carl Arft2, Jin-Tae Kim2, Niveditha Arumugam2, Pavan Gupta2, Sassan Tabatabaei2, Sudhakar Pamarti4, Haechang Lee2, Fari Assaderaghi2 Masdar Institute of Science and Technology, Abu Dhabi, United Arab
ISSCC 2012 Session 11 Sensors
A ±0.4°C (3σ) -70 to 200°C Time-Domain Temperature Sensor Based on Heat Diffusion in Si and SiO2
Caspar van Vroonhoven1, Dan D’Aquino2, Kofi Makinwa1
National Semiconductor, Santa Clara, CA 1 2 Despite the increasing use of ICs at very high temperatures (>150°C) in automotive and industrial applications, sensing such temperatures is still mostly done with discrete the
ISSCC 2012 Session 11 Sensors
ASIC for a Resonant Wireless Pressure-Sensing System for Harsh Environments Achieving ±2% Error Between -40 and 150°C Using Q-Based Temperature Compensation
Marko Rocznik1, Fabian Henrici2, Remigius Has2
increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit’
ISSCC 2012 Session 11 Sensors
A 50µW Biasing Feedback Loop with 6ms Settling Time for a MEMS Microphone with Digital Output Jeroen van den Boom
NXP Semiconductors, Nijmegen, The Netherlands, A MEMS microphone is a variable capacitor where the distance d between th
compliant membrane and the rigid backplate is proportional to the air (acoustic) pressure. If the charge Q at the plates remains constant, there is a linear relationship between the voltage across the plates and the dist
ISSCC 2012 Session 11 Sensors
A Capacitance-to-Digital Converter for Displacement Sensing with 17b Resolution and 20µs Conversion Time
Sha Xia, Kofi Makinwa, Stoyan Nihtianov
In precision mechatronic systems, such as wafer steppers, the position of critical mechanical components must be dynamically stabilized with sub-nanometer precision. This can be achieved by a servo loop consisting of a d
ISSCC 2012 Session 11 Sensors
A ΔΣ Interface for MEMS Accelerometers Using Electrostatic Spring-Constant Modulation for Cancellation of Bondwire Capacitance Drift
Pedram Lajevardi1, Vladimir Petkov2, Boris Murmann1
Robert Bosch, Palo Alto, CA 1 2 Precision accelerometers are used in a variety of automotive applications, navigation systems, and low-level vibration-monitoring systems. Currently, these sensors are factory-calibrated t
ISSCC 2010 Session 17 Sensors
A 200MHz 300ps 0.5pJ/ns Optical Pulse Generator Array in 0.35µm CMOS
Bruce R Rae1, Jonathan McKendry2, Zheng Gong2, Erdan Gu2,
United Kingdom 2 Short optical pulses are required for diagnostic techniques in life sciences such as fluorescence lifetime imaging, which can be used for quantitative detection of ion concentrations, oxygen and fluoresc
ISSCC 2010 Session 17 Sensors
A Closed-Loop SC Interface for a ±1.4g Accelerometer with 0.33% Nonlinearity and 2µg/√Hz Input Noise Density
Mikail Yucetas, Jarno Salomaa, Antti Kalanti, Lasse Aaltonen, Kari Halonen
which allows the resonances of the element to be efficiently damped and permits, for example, an open-loop readout of the element. If the accelerometer is required to attain very low Brownian noise levels or packaged tog
ISSCC 2010 Session 17 Sensors
A 76dBΩ 1.7GHz 0.18µm CMOS Tunable Transimpedance Amplifier Using Broadband Current Pre-Amplifier for High Frequency Lateral Micromechanical Oscillators
Hossein Miri Lavasani1, Wanling Pan1, Brandon Harrington2, Reza Abdolvand2, Farrokh Ayazi1
Georgia Institute of Technology, Atlanta, GA Oklahoma State University, Tulsa, OK 2 The frequency reference oscillator is a pivotal block in modern radio transceivers. Currently, modern transceivers rely on off-chip low
ISSCC 2010 Session 17 Sensors
An In-Situ Temperature-Sensing Interface Based on a SAR ADC in 45nm LP Digital CMOS for the Frequency-Temperature Compensation of Crystal Oscillators
Zhenning Wang1, Richard Lin2, Eshel Gordon3, Hasnain Lakdawala2,
L.Richard Carley1, Jonathan C. Jensen2 1 Carnegie Mellon University, Pittsburgh, PA Intel, Hillsboro, OR 3 Intel, Haifa, Israel 2 Multi-radio (3G/4G/GPS) mobile communication devices impose stringent requirements (<1ppm)
ISSCC 2010 Session 17 Sensors
A Thermal-Diffusivity-Based Temperature Sensor with an Untrimmed Inaccuracy of ±0.2°C (3σ) from –55°C to 125°C
Caspar P.L. van Vroonhoven1, Dan d’Aquino2, Kofi A.A. Makinwa1, 1
based on the thermal diffusivity of silicon. Its digital output is insensitive to both process spread and packaging stress and is a near-linear function of absolute temperature. The sensor’s accuracy is mainly limited by
ISSCC 2010 Session 17 Sensors
A 1.2V 10µW NPN-Based Temperature Sensor in 65nm CMOS with an Inaccuracy of ±0.2°C (3σ) from –70°C to 125°C
Fabio Sebastiano1,2, Lucien J. Breems1, Kofi A. A. Makinwa2,
Salvatore Drago1,3, Domine M. W, Leenaerts1, Bram Nauta3 1 NXP Semiconductors, Eindhoven, Netherlands Delft University of Technology, Delft, Netherlands 3 University of Twente, Enschede, Netherlands 2 This paper describe
ISSCC 2010 Session 17 Sensors
A System-on-Chip EPC Gen-2 Passive UHF RFID Tag with Embedded Temperature Sensor
Jun Yin, Jun Yi, Man Kay Law, Yunxiao Ling, Man Chiu Lee,
Kwok Ping Ng, Bo Gao, Howard Cam Luong, Amine Bermak, Mansun Chan, Wing-Hung Ki, Chi-Ying Tsui, Matthew Ming-Fai Yuen Hong Kong University of Science and Technology, Hong Kong, China A system-on-chip passive UHF RFID tag
ISSCC 2009 Session 20 Sensors
A 0.25µm Logarithmic CMOS Imager for EmissivityCompensated Thermography
Franz X. Hutter, Daniel Brosch, Heinz-Gerd Graf, Wolfram Klingler,
Markus Strobel, Joachim N. Burghartz Institute for Microelectronics, Stuttgart, Germany Challenges in the design of solid-state imagers for industrial measurement and control include: high image resolution, wide temperat
ISSCC 2009 Session 20 Sensors
A 2×32 Range-Finding Sensor Array with PixelInherent Suppression of Ambient Light up to 120klx
Gerald Zach, Horst Zimmermann
Real-time 3D imaging has reached a state of development where several fields of application are possible, such as factory automation, consumer electronics, security, and robotics. The first commercial products have alrea
ISSCC 2009 Session 20 Sensors
A Compact CMOS MEMS Microphone with 66dB SNR
Jelena Čitaković1,2, Per F. Høvesten1, Gino Rocca1, Aart van Halteren3,
Pirmin Rombach1, Lars J. Stenberg1, Pietro Andreani4, Erik Bruun2 Pulse MEMS, Roskilde, Denmark Technical University of Denmark, Lyngby, Denmark 3 Pulse Advanced Acoustics, Amsterdam, Netherlands 4 Lund University, Lund,
ISSCC 2009 Session 20 Sensors
A Sub-pA ∆Σ Current Amplifier for Single-Molecule Nanosensors
Marco Bennati1, Federico Thei1, Michele Rossi2, Marco Crescentini1,
University of Milano-Bicocca, Milano, Italy 2 Current readout has been a known technique since the inception of electronic sensors and is widely used, for example, in radiation detectors, impedance spectroscopy, and mech
ISSCC 2009 Session 20 Sensors
An Instrument-on-Chip for Impedance Measurements on Nanobiosensors with attoFarad Resolution
Fabio Gozzini, Giorgio Ferrari, Marco Sampietro
Impedance measurements play a fundamental role in biotechnology, serving both as an investigation tool and as a direct detection technique. Tracking impedance over time is extensively used for spatial monitoring, imaging
ISSCC 2009 Session 20 Sensors
An Interface for a 300°/s Capacitive 2-Axis MicroGyroscope with Pseudo-CT Readout
Lasse Aaltonen1, Timo Speeti1, Mikko Saukoski1,2, Kari Halonen1, 1
The widespread use of capacitive MEMS vibratory gyroscopes is powerfully driven by low cost [1]; this is partly determined by factors such as die area and the number of necessary external components. Important properties
ISSCC 2009 Session 20 Sensors
A CMOS Smart Temperature Sensor with a BatchCalibrated Inaccuracy of ±0.25°C (3σ) from -70°C to 130°C
André L. Aita1,2, Michiel A. P. Pertijs3, Kofi A. A. Makinwa1, Johan H. Huijsing1
Delft University of Technology, Delft, Netherlands Federal University of Santa Maria, Santa Maria, Brazil 3 Holst Centre, Eindhoven, Netherlands 2 A major contributor to the total cost of precision CMOS temperature senso
ISSCC 2009 Session 20 Sensors
A 1.05V 1.6mW 0.45°C 3σ-Resolution ∆Σ-Based Temperature Sensor with Parasitic-Resistance Compensation in 32nm CMOS
Y. William Li, Hasnain Lakdawala, Arijit Raychowdhury, Greg Taylor, K. Soumyanath
Intel, Hillsboro, OR In the multicore era, thermal/power management is essential in order to meet platform-performance and energy-efficiency requirements. Accurate temperature measurements are required to reliably maximi
ISSCC 2009 Session 17 Sensors
An Optically Programmable SoC for an Autonomous mm3-Sized Microrobot
R. Casanova, A. Dieguez, A. Arbat, O. Alonso, A. Sanuy, J. Canals, J. Samitier
Miniaturizing its components, power source, sensors and actuators, has proven challenging. As a consequence, few autonomous microrobots have been reported until recently [1-3]. These are simple mobile platforms, without
ISSCC 2009 Session 17 Sensors
Integrated Capacitive Power-Management Circuit for Thermal Harvesters with Output Power 10 to 1000µW
I. Doms1,2, P. Merken1,3, R. Mertens1,2, C. Van Hoof1,2, 1
U.Leuven, Leuven, Belgium 3 R.M.A., Brussels, Belgium 2 Energy harvesters [1] power energy-autonomous wireless sensor systems by converting ambient environmental energy into electrical energy. Thermoelectric generators (
ISSCC 2009 Session 17 Sensors
An Energy-Aware Multiple-Input Power Supply with Charge Recovery for Energy Harvesting Applications
Nathaniel J. Guilar¹,², Rajeevan Amirtharajah¹, Paul J. Hurst¹, Stephen H. Lewis¹
¹University of California, Davis, CA ²Agilent Technologies, Santa Clara, CA Energy harvesting systems such as self-powered wireless sensor nodes rely on a diverse set of energy sources in their continuously changing envi
ISSCC 2009 Session 17 Sensors
An Efficient Piezoelectric Energy-Harvesting Interface Circuit Using a Bias-Flip Rectifier and Shared Inductor
Yogesh K. Ramadass, Anantha P. Chandrakasan
Energy harvesting is an emerging technology with applications to handheld, portable and implantable electronics. Harvesting ambient vibration energy through piezoelectric (PE) means is a popular energy harvesting techniq
ISSCC 2009 Session 17 Sensors
A mm-Sized Implantable Power Receiver with Adaptive Link Compensation
Stephen O’Driscoll, Ada S. Y. Poon, Teresa H. Meng
Wireless powering of implanted devices obviates the need for batteries, which must be periodically replaced and constitute a health risk. There has long been an assumption that efficient wireless transfer of power to bio
ISSCC 2009 Session 17 Sensors
An Integrated Power Supply System for Low-Power 3.3V Electronics Using On-Chip Polymer Electrolyte Membrane (PEM) Fuel Cells
M. Frank1, M. Kuhl1, G. Erdler2*, I. Freund2, Y. Manoli1, C. Müller1, H. Reinecke1
g. autonomous sensor systems (Fig. 17.4.4). Therefore a periodic system wake up is implemented, controlled by an on-chip oscillator and a programmable timing network. To generate a constant output voltage of 3.3V for dut
ISSCC 2009 Session 17 Sensors
A 5.2mW Self-Configured Wearable Body Sensor Network Controller and a 12µW 54.9% Efficiency Wirelessly Powered Sensor for Continuous Health Monitoring System
Jerald Yoo, Long Yan, Seulki Lee, Yongsang Kim, Hyejung Kim,
diseases in everyday life, but their large form factors or battery power limitations still remain to be solved. Security and/or requirements of interference resilience are stringent for health monitoring, and therefore,
ISSCC 2009 Session 17 Sensors
A Release-on-Demand Wireless CMOS Drug Delivery SoC Based on Electrothermal Activation Technique
Yao-Joe Yang, Yu-Jie Huang, Hsin-Hung Liao, Tao Wang, Pen-Li Huang,
biomedical applications. Although in vitro analytical and diagnostic tools have been the focus of such technologies, in vivo therapeutic and sensing applications have received significant attention in the past few years.
ISSCC 2009 Session 17 Sensors
A Robust Wireless Sensor Node for In-Tire-Pressure Monitoring
Martin Flatscher1, Markus Dielacher1, Thomas Herndl1,
Thomas Lentsch1, Rainer Matischek1, Josef Prainsack1, Wolfgang Pribyl2, Horst Theuss3, Werner Weber4 Infineon, Graz, Austria Graz University of Technology, Graz, Austria 3 Infineon, Regensburg, Germany 4 Infineon, Munich
ISSCC 2008 Session 32 Sensors
A 16×16 CMOS Proton Camera Array for Direct Extracellular Imaging of Hydrogen-Ion Activity
Mark J. Milgrew, Mathis O. Riehle, David R. S. Cumming
Over the past twenty-five years, silicon CMOS technology has firmly established itself as the dominant platform in the microelectronics industry. This has resulted in many recent initiatives to fabricate CMOS-based micro
ISSCC 2008 Session 32 Sensors
A 100µW 64×128-Pixel Contrast-Based Asynchronous Binary Vision Sensor for Wireless Sensor Networks
N. Massari, M. Gottardi, S. Jawed
Raster-scan architectures are mostly oriented toward quality image reproduction [1], but they do not meet some basic requirements,that are crucial for battery-operated sensors for sensor network applications, such as low
ISSCC 2008 Session 32 Sensors
Single-Chip CMOS Analog Sensor-Conditioning ICs with Integrated Electrically-Adjustable Passive Resistors
Leslie Landsberger, Oleg Grudin, Saed Salman, Tommy Tsang,
integration of sensors and/or MEMS with ICs for many purposes, including enhancing the performance of the ICs [1]. Post-packaging or post-assembly in-system adjustment of analog circuits is increasing in industrial impor
ISSCC 2008 Session 32 Sensors
A Chopper-Stabilized Lateral-BJT-Input Interface in 0.6µm CMOS for Capacitive Accelerometers
Dongning Zhao, M. Faisal Zaman, Farrokh Ayazi
There has been increasing demand for low-cost small-size highprecision MEMS accelerometers with micro-gravity resolution at very low frequencies in applications ranging from GPS-augmented inertial navigation to distance
ISSCC 2008 Session 32 Sensors
An RF MEMS Variable Capacitor with Intelligent Bipolar Actuation IBA, no failure is observed up to 1.7×108 cycles, indicating that the charging suppression mechanism is working successfully.
Tamio Ikehashi, Takayuki Miyazaki, Hiroaki Yamazaki, Atsushi Suzuki,
Etsuji Ogawa, Shinji Miyano, Tomohiro Saito, Tatsuya Ohguro, Takeshi Miyagi, Yoshiaki Sugizaki, Nobuaki Otsuka, Hideki Shibata, Yoshiaki Toyoshima The IBA operation described above is realized by a circuit whose block di
ISSCC 2008 Session 32 Sensors
A Mode-Matching ΔΣ Closed-Loop VibratoryGyroscope Readout Interface with a 0.004°/s/√Hz Noise Floor over a 50Hz Band
Chinwuba D. Ezekwe1,2, Bernhard E. Boser1, 1
floors, mode matching is necessary to moderate interface power dissipation. Mode matching increases sense displacements by the sense mode quality factor and thereby relaxes the precision requirements of the front-end, bu
ISSCC 2008 Session 32 Sensors
A 1.5μW 1V 2nd-Order ΔΣ Sensor Front-End with Signal Boosting and Offset Compensation for a Capacitive 3-Axis Micro-Accelerometer
Mika Kämäräinen, Matti Paavola, Mikko Saukoski, Erkka Laulainen,
current and the capability of achieving high sensitivity, are emphasized in ultra-low-power applications. In [1], representing the current state-of-the-art in low-power 3-axis micro-accelerometers, capacitance-to-voltage
ISSCC 2008 Session 32 Sensors
A CMOS Temperature-to-Digital Converter with an Inaccuracy of ±0.5°C (3σ) from –55 to 125°C
C. P. L. van Vroonhoven, K. A. A. Makinwa
This paper describes a CMOS temperature-to-digital converter (TDC) based on thermal diffusivity sensing, which is an interesting alternative to conventional band-gap temperature sensors because the thermal diffusivity of