ISSCC 2022
Session 17
Wireline I/O
A 480-Multiplication-Factor 13.2-to-17.3GHz Sub-Sampling PLL Achieving 6.6mW Power and -248.1dB FoM Using a Proportionally Divided Charge Pump
Beyond-10GHz frequency synthesizers are ubiquitous building blocks for today’s evergrowing wireless and wireline communication systems. To meet the stringent requirements on data-rate and modulation schemes, the phase no
ISSCC 2022
Session 17
Wireline I/O
A 56GHz 23mW Fractional-N PLL with 110fs Jitter
PAM-4 wireline transmitters operating at 224Gb/s can employ a 56GHz PLL for multiplexing. Such an environment poses several constraints on the design. First, the PLL rms jitter must be no more than a few percent of the s
ISSCC 2022
Session 17
Wireline I/O
A 10Gb/s Digital Isolator Using Coupled Split-Ring Resonators with 24kVpk Surge Capability and 100kV/µS Common-Mode Transient Immunity
High speed data links play a key role in industrial and medical systems. Galvanic isolation in high-speed links ensures the safety of human operators and instruments. Optoisolators generally achieve high voltage ratings
ISSCC 2022
Session 17
Wireline I/O
A 2.4pJ/b 100Gb/s 3D-Integrated PAM-4 Optical Transmitter with Segmented SiP MOSCAP Modulators and a 2-Channel 28nm CMOS Driver
David J. Thomson2, Martin Ebert2, Li Ke2, Graham T. Reed2, Azita Emami1 California Institute of Technology, Pasadena, CA University of Southampton, Southampton, United Kingdom 1 2 Data centers continue to require interco
ISSCC 2022
Session 17
Wireline I/O
A 4.6pJ/b 200Gb/s Analog DP-QPSK Coherent Optical Receiver in 28nm CMOS
cloud computing, have significantly driven the requirement for high transmission data rates. Polarization diversity coherent detection is an indispensable technique for realizing high-capacity transmission owing to its e
ISSCC 2021
Session 8
Wireline I/O
A 112Gb/s PAM-4 Low-Power 9-Tap Sliding-Block DFE in a 7nm FinFET Wireline Receiver
equalization (e.g. extensive FFE and DFE) of wireline channels. FFE and canonical DFE sizes scale linearly with the number of taps, however the computational complexity of an FFE is much greater than that of a DFE. The c
ISSCC 2021
Session 8
Wireline I/O
A 112Gb/s ADC-DSP-Based PAM-4 Transceiver for Long-Reach Applications with >40dB Channel Loss in 7nm FinFET peaking inductor is leveraged to resonate out the parasitic & transistor gate capacitances. A flipped voltage follower buffer is used to isolate the CTLE from the 16 TAHs. The DCgain normalized frequency response at the output of the AFE for various CTLE settings is shown in the Fig. 8.7.3.
K. Raviprakash1, L. Tse1, M. Davoodi4, M. Takefman3, N. Fan4, P. Prabha4, Q. Liu2, Q. Wang1, R. Nagulapalli5, S. Cyrusian4, S. Jantzi4, S. Scouten3, T. Dusatko6, T. Setya3, V. Giridharan1, V. Gurumoorthy1, V. Karam3, W.
ISSCC 2021
Session 8
Wireline I/O
A Highly Reconfigurable 40-97GS/s DAC and ADC with 40GHz AFE Bandwidth and Sub-35fJ/conv-step for 400Gb/s Coherent Optical Applications in 7nm FinFET
E. Olsen1, F. Ahmad1, G. Hatcher1, J. Chana3, L. Biolato2, L. Tse4, L. Wang1, L. Wang4, M. Azarmnia1, M. Davoodi1, N. Campos2, N. Fan1, P. Prabha1, Q. Lu1, S. Cyrusian1, S. Dallaire5, S. Ho3, S. Jantzi1, T. Dusatko3, W.
ISSCC 2021
Session 8
Wireline I/O
A Scalable Adaptive ADC/DSP-Based 1.25-to-56Gbps/112Gbps High-Speed Transceiver Architecture Using Decision-Directed MMSE CDR in 16nm and 7nm
Larry Moser1, Yang Zhang1, Xiaolong Liu1, Man Pio Lam1, Haikun Jia2,3, Quan Pan2,4, Wing Hong Szeto2, Chi Fai Tang2, Ka Fai Mak2, Khawar Sarfraz2, Tairan Zhu1, Ming Kwan1, Emily Yim Lee Au1, Cormac Conroy1, Kai Keung Cha
ISSCC 2021
Session 8
Wireline I/O
A 116Gb/s DSP-Based Wireline Transceiver in 7nm CMOS Achieving 6pJ/b at 45dB Loss in PAM-4/Duo-PAM-4 and 52dB in PAM-2
Faisal Ahmed Musa, Haitao Mei, Mohammad-Mahdi Mohsenpour, Semyon Lebedev, Babak Zamanlooy, Carlos Carvalho, Qian Xin, Dmitry Petrov, Henry Wong, Huong Ho, Yang Xu, Sina Naderi Shahi, Peter Krotnev, Chris Feist, Howard Hu
ISSCC 2021
Session 8
Wireline I/O
An 8b DAC-Based SST TX Using Metal Gate Resistors with 1.4pJ/b Efficiency at 112Gb/s PAM-4 and 8-Tap FFE in 7nm CMOS
Thomas Morf1, Serdar A. Yonar1, Mridula Prathapan1, Eric J. Lukes2, Raymond A. Richetta2, Carrie Cox3 IBM Research, Rüschlikon, Switzerland IBM Systems and Technology, Rochester, MN 3 IBM Systems and Technology, Durham,
ISSCC 2021
Session 8
Wireline I/O
An Output-Bandwidth-Optimized 200Gb/s PAM-4 100Gb/s NRZ Transmitter with 5-Tap FFE in 28nm CMOS
for ultra-high-speed interconnects has driven the development of wireline TXs operating at >100Gb/s per lane [1-4]. This paper presents a PAM-4 TX achieving 200Gb/s with improved output bandwidth and output swing by mini
ISSCC 2021
Session 8
Wireline I/O
A 224Gb/s DAC-Based PAM-4 Transmitter with 8-Tap FFE in 10nm CMOS
Bong Chan Kim1, Stephen Kim1, Yutao Liu1, Savyassachi Keshava Murthy1, Priya Wali1, Kai Yu1, Hyung Seok Kim1, Chuan-chang Liu1, Dongseok Shin1, Ariel Cohen3, Yongping Fan1, Frank O’Mahony1 Intel, Hillsboro, OR Foundation
ISSCC 2021
Session 19
Wireline I/O
A MEMS-Based Dynamic Light Focusing System for Single-Cell Precision in Optogenetics
Mohammad Meraj Ghanbari1, Nick Antipa1, Sina Faraji Alamouti1, Laura Waller1,2, Daniel Lopez3, Rikky Muller1,2 University of California, Berkeley, CA Chan Zuckerberg Biohub, San Francisco, CA 3 National Institute of Stan
ISSCC 2021
Session 19
Wireline I/O
A Mechanically Flexible Implantable Neural Interface for Computational Imaging and Optogenetic Stimulation over 5.4×5.4mm2 FoV
Jacob T. Robinson3, Ashok Veeraraghavan3, Kenneth L. Shepard1 Columbia University, New York, NY University of Washington, Seattle, WA 3 Rice University, Houston, TX 1 2 *Equally-Credited Authors (ECAs) The advent of gene
ISSCC 2021
Session 19
Wireline I/O
Optical Phased-Array FMCW LiDAR with On-Chip Calibration
Light detection and ranging (lidar) sensors provide high resolution and high accuracy for diverse applications such as autonomous vehicles and three-dimensional imagers. Over the past few years, there has been significan
ISSCC 2021
Session 11
Wireline I/O
A 105Gb/s Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-to-335GHz Signal and Integrated Waveguide Coupler
Raytheon, Tewksbury, MA 3 Intel, Chandler, AZ 1 The rapid surge of data transmission within computation, storage and communication infrastructures is pushing the speed boundary of traditional copper-based electrical link
ISSCC 2021
Session 11
Wireline I/O
An Echo-Cancelling Front-End for 112Gb/s PAM-4 Simultaneous Bidirectional Signaling in 14nm CMOS
Govert Geelen2, Corné Bastiaansen2, Narendra Rao1, Viswa Popuri1, Greg Shen1, Hamid Khatibi1, Saudas Dey3, Anirban Chatterjee3, David Shen1, Peter Zijlstra2, Harrie Gunnink2, Kebin Zhang1, Venkat Penumuchu1, Oliver Weiss
ISSCC 2021
Session 11
Wireline I/O
A 56Gb/s 50mW NRZ Receiver in 28nm CMOS
The power consumption of wireline transceivers has become increasingly critical as higher data rates and a larger numbers of lanes per chip are sought [1-6]. While attractive for lossy channels, PAM-4 signaling has mostl
ISSCC 2021
Session 11
Wireline I/O
A 100Gb/s -8.3dBm-Sensitivity PAM-4 Optical Receiver with
g. 400G-DR4/FR4) have been developed to address the rapid increase in interconnect BW demand created by data-centric computing [1]. Low-cost 100Gb/s PAM-4 optical transceivers are critical to spur their adoption in high
ISSCC 2021
Session 11
Wireline I/O
A 23.9-to-29.4GHz Digital LC-PLL with a Coupled Frequency Doubler for Wireline Applications in 10nm FinFET
100Gb/s+ is rapidly increasing to accommodate the massive data traffic of data centric systems such as Internet-of-things, autonomous driving, cloud computing, etc. In recent publications, a 14GHz LC-PLL was successfully
ISSCC 2021
Session 11
Wireline I/O
A High-Accuracy Multi-Phase Injection-Locked 8-Phase 7GHz Clock Generator in 65nm with 7b Phase Interpolators for High-Speed Data Links
*Equally-Credited Authors (ECAs) The ever-increasing Internet data demand imposes stringent requirements on wireline transceiver speed, jitter, and power. A low-noise, multi-phase clock generator (MPCG) is a crucial buil
ISSCC 2021
Session 11
Wireline I/O
A 480Gb/s/mm 1.7pJ/b Short-Reach Wireline Transceiver Using Single-Ended NRZ for Die-to-Die Applications
Chris Moscone, Qazi Omar Farooq Cadence, Cary, NC With recent AI and big data developments, quickly moving massive amounts of data is paramount to future technologies. Scalable solutions that can sustain higher performan
ISSCC 2021
Session 11
Wireline I/O
A 26.5625-to-106.25Gb/s XSR SerDes with 1.55pJ/b Efficiency in 7nm CMOS
George Ng1, Nanyan Wang2, Javid Musayev1, Gairik Dutta1, Masumi Shibata1, Arash Moradi1, Haleh Vahedi1, Manavi Farzad1, Prabhnoor Kainth1, Matt Yu1, Nhat Nguyen2, Jennifer Pham1, Angus McLaren1 Rambus, Toronto, Canada Ra
ISSCC 2021
Session 11
Wireline I/O
A 1.7pJ/b 112Gb/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology
Mohammad Elbadry1, Ahmed ElShater1, Tsz-Bin Liu2, Joonyeong Lee1, Dhinessh Ramachandran1, Kaiz Wang2, Chih-Hao Weng2, Mau-Lin Wu2, Tamer Ali1 MediaTek, Irvine, CA MediaTek, Hsinchu, Taiwan 1 2 *Equally-Credited Authors (
ISSCC 2020
Session 6
Wireline I/O
A 100Gb/s NRZ Transmitter with 8-Tap FFE Using a 7b DAC in 40nm CMOS
satisfy the continuously growing demands for wireline communications [1-5]. Although PAM-4 signaling performs two-fold bandwidth efficiency compared with the NRZ counterpart, the NRZ signal still has the advantage in low
ISSCC 2020
Session 6
Wireline I/O
An 8Gb/s/µm FFE-Combined Crosstalk-Cancellation Scheme for HBM on Silicon Interposer with 3D-Staggered Channels
a silicon interposer technology to increase the number of I/O pins. Interfaces with the silicon interposer provide a higher throughput (Gb/s/µm) than other packaging technologies due to the high channel density. To incre
ISSCC 2020
Session 6
Wireline I/O
Reference-Noise Compensation Scheme for SingleEnded Package-to-Package Links
Brian Zimmer1, Thomas H. Greer2, John W. Poulton2, Sanquan Song1, Walker J. Turner2, John M. Wilson2, C. Thomas Gray2 NVIDIA, Santa Clara, CA NVIDIA, Durham, NC 1 2 A recent trend in high-performance systems is distribut
ISSCC 2020
Session 6
Wireline I/O
A 6.4-to-32Gb/s 0.96pJ/b Referenceless CDR Employing ML-Inspired Stochastic Phase-Frequency Detection Technique in 40nm CMOS
Continuous-rate referenceless clock and data recovery (CDR) circuits are capable of operating over a wide range of data rates in multiple standards. To achieve wide-range operation without an external reference clock, se
ISSCC 2020
Session 6
Wireline I/O
A 56Gb/s 7.7mW/Gb/s PAM-4 Wireline Transceiver in 10nm FinFET Using MM-CDR-Based ADC Timing Skew Control and Low-Power DSP with Approximate Multiplier
Seung-Yeob Baek, Naxin Kim, Dong-Ho Choi, Young-Ho Choi, Hyeyeon Yang, Taehun Yoon, Sang-Hyeok Chu, Kangjik Kim, Woochul Jung, Bong-Kyu Kim, Jaechol Lee, Gunil Kang, Sang-Hune Park, Michael Choi, Jongshin Shin Samsung El
ISSCC 2020
Session 6
Wireline I/O
A 10-to-112Gb/s DSP-DAC-Based Transmitter with 1.2Vppd Output Swing in 7nm FinFET
Socrates Vamvakos1, Haidang Lin1, Simon Li1, Marcus van Ierssel3, Prashant Choudhary1, Nanyan Wang1, Masumi Shibata3, Mohammad Hossein Taghavi3, Nhat Nguyen1,4, Shaishav Desai1 Rambus, Sunnyvale, CA, 2University of Alber
ISSCC 2020
Session 6
Wireline I/O
A 460mW 112Gb/s DSP-Based Transceiver with 38dB Loss Compensation for Next-Generation Data Centers in 7nm FinFET Technology
Yu-Ming Ying1, Mohammed Abdullatif1, Miguel Gandara1, Chun-Cheng Liu2, Po-Shuan Weng2, Huan-Sheng Chen2, Mohammad Elbadry1, Qaiser Nehal1, Kun-Hung Tsai2, Kevin Tan2, Yi-Chieh Huang2, Chung-Hsien Tsai2, Yuyun Chang2, Yua
ISSCC 2020
Session 6
Wireline I/O
A 112Gb/s PAM-4 Long-Reach Wireline Transceiver Using a 36-Way Time-Interleaved SAR-ADC and Inverter-Based RX Analog Front-End in 7nm FinFET
Stanley Chen1, Yipeng Wang2, Hao-Wei Hung2, KeeHian Tan2, Winson Lin1, Arianne Roldan1, Declan Carey3, Ilias Chlis3, Ronan Casey3, Ade Bekele1, Ying Cao1, David Mahashin1, Hong Ahn1, Hongtao Zhang1, Yohan Frans1, Ken Cha
ISSCC 2020
Session 12
Wireline I/O
A 700mW 4-to-1 SiGe BiCMOS 100GS/s Analog Time-Interleaver
DACs with an analog bandwidth (BW) of at least 50GHz to support advanced modulation schemes. CMOS-based DACs are preferred because they support monolithic integration of the DSP and DAC, but the achievable sampling rate
ISSCC 2020
Session 12
Wireline I/O
A 48GHz BW 225mW/ch Linear Driver IC with Stacked Current-Reuse Architecture in 65nm CMOS for Beyond-400Gb/s Coherent Optical Transmitters
attention for constructing large-capacity optical core/metro networks and even data center interconnects. Data rates in the next generation of coherent optical transmission systems are expected to exceed 400Gb/s, for whi
ISSCC 2020
Session 12
Wireline I/O
A 4-Channel 200Gb/s PAM-4 BiCMOS Transceiver with Silicon Photonics Front-Ends for Gigabit Ethernet Applications
Angelo Palladino1, Antonio Santipo1, Lorenzo Gerosa1, Matteo Repossi1, Gianluca Catrini2, Marta Campo2, Francesco Radice1, Andrea Diodato1, Roberto Pelleriti2, Daniele Baldi1, Laura Tarantini1, Luca Maggi1, Gianluca Rada
ISSCC 2020
Session 12
Wireline I/O
A 3D-Integrated Microring-Based 112Gb/s PAM-4 Silicon-Photonic Transmitter with Integrated Nonlinear Equalization and Thermal Control
stringent demands on the bandwidth and energy efficiency of data center interconnects, spurring the development of several 400G Ethernet standards [1]. Siliconphotonics-based solutions are of particular interest for low
ISSCC 2019
Session 6
Wireline I/O
A 36Gb/s Adaptive Baud-Rate CDR with CTLE and 1-Tap DFE in 28nm CMOS
circuits (CDR) are ubiquitous in recent receiver designs as a means of lowering power consumption by sampling the data only once per UI. To further reduce power, prior works in pattern-based baud-rate PD
ISSCC 2019
Session 6
Wireline I/O
A 112Gb/s PAM-4 Voltage-Mode Transmitter with 4-Tap Two-Step FFE and Automatic Phase Alignment Techniques in 40nm CMOS
transmitters to operate at higher speeds. The applications of 400GbE also push the transmitter to be designed at 112Gb/s for a single lane [1-2]. However, the use of advanced processes (<16nm) hardly reduces the costs. T
ISSCC 2019
Session 6
Wireline I/O
A 128Gb/s 1.3pJ/b PAM-4 Transmitter with Reconfigurable 3-Tap FFE in 14nm CMOS
Herschel A. Ainspan, Timothy O. Dickson, Michael P. Beakes, Mounir Meghelli IBM T. J. Watson Research Center, Yorktown Heights, NY The ever-increasing demand for higher bandwidth continues to fuel the need for faster and
ISSCC 2019
Session 6
Wireline I/O
A 400Gb/s Transceiver for PAM-4 Optical Direct-Detect Application in 16nm FinFET
F. Rad3, J. Riani3, J. Pernillo3, J. Sun1, J. Wong3, K. Abdelhalim2, K. Gopalakrishnan3, K. Kim2, L. Tse3, M. Davoodi2, M. Le2, M. Zhang3, M. Talegaonkar2, P. Prabha2, R. Mohanavelu3, S. Chong1, S. Forey4, S. Netto3, S.
ISSCC 2019
Session 6
Wireline I/O
A 180mW 56Gb/s DSP-Based Transceiver for HighDensity IOs in Data Center Switches in 7nm FinFET Technology
Po-Shuan Weng2, Yi-Chieh Huang2, Chun-Cheng Liu2, Chien-Hua Wu2, Shih-Hao Huang2, Chungshi Lin2, Ke-Chung Wu2, Kun-Hung Tsai2, Kai-Wen Tan2, Ahmed ElShater1, Kuang-Ren Chen2, Wei-Hao Tsai2, Huan-Sheng Chen2, Weiyu Leng1,
ISSCC 2019
Session 6
Wireline I/O
A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET
Marco Sosio, Enrico Pozzati, Nicola Ghittori, Federico Magni, Marco Garampazzi, Giacomino Bollati, Antonio Milani, Alberto Minuti, Fabio Giunco, Paola Uggetti, Ivan Fabiano, Nicola Codega, Alessandro Bosi, Nicola Carta,
ISSCC 2019
Session 6
Wireline I/O
A 60Gb/s PAM-4 ADC-DSP Transceiver in 7nm CMOS with SNR-Based Adaptive Power Scaling Achieving 6.9pJ/b at 32dB Loss
Semyon Lebedev, Petar Krotnev, Dorin Alexandru Nicolescu, Dmitry Petrov, Carlos Carvalho, Stephen Alie, Euhan Chong, Faisal Ahmed Musa, Davide Tonietto Huawei Technologies, Ottawa, ON, Canada With the introduction of PAM
ISSCC 2019
Session 6
Wireline I/O
A 100Gb/s 1.1pJ/b PAM-4 RX with Dual-Mode 1-Tap PAM4 / 3-Tap NRZ Speculative DFE in 14nm CMOS FinFET
wireline communications has led to emerging standards in the 100Gb/s+ range using PAM-4 signaling. ADC-based receivers have demonstrated robust operation over channels with high losses (>20dB) [1], but their power consum
ISSCC 2019
Session 30
Wireline I/O
A 140fsrms-Jitter and -72dBc-Reference-Spur Ring-VCOBased Injection-Locked Clock Multiplier Using a Background Triple-Point Frequency/Phase/Slope Calibrator
generate low-jitter high-frequency signals, while using a ring VCO. In the sense that the VCO jitter is removed periodically by the reference clock, SREF, an MDLL also can be considered to be an ILCM. However, the most c
ISSCC 2019
Session 30
Wireline I/O
A 0.65V 12-to-16GHz Sub-Sampling PLL with 56.4fsrms Integrated Jitter and -256.4dB FoM output current of the I-SSCP is zero, which means the sampled input differential voltage (VSAM+-VSAM-) is around 0V. At the same time, (VP+-VP-) is also around 0V, and both VP+ and VP- are kept almost constant regardless of the output frequency.
To solve the issue of the conventional SSPD mentioned above, the LV SSPD (Fig. 30.8.3) is adopted. It adopts two high-level boosted inverters (HBINV) to enhance the turn-on voltage of the gate of M1 and M2 in the SSPD. T
ISSCC 2019
Session 30
Wireline I/O
An 8b Injection-Locked Phase Rotator with Dynamic Multiphase Injection for 28/56/112Gb/s Serdes Application
Growing traffic in data centers imposes multiple challenges on serial link design with higher speed and stringent power requirements. Clocking is one major challenge due to the significant portion of total power that clock
ISSCC 2019
Session 30
Wireline I/O
A 6V Swing 3.6% THD >40GHz Driver with 4.5× Bandwidth Extension for a 272Gb/s Dual-Polarization 16-QAM Silicon Photonic Transmitter
Yangjin Ma2, Tam Huynh2, Christopher Williams2, Leonardo Vera2, Yang Liu2, Ruizhi Shi2, Matthew Streshinsky2, Ari Novack2, Ran Ding2, Rick Younce2, Rafid Sukkar2, Jose Roman2, Michael Hochberg2, Sudip Shekhar1, Alexander
ISSCC 2019
Session 30
Wireline I/O
A 1.41pJ/b 56Gb/s PAM-4 Wireline Receiver Employing Enhanced Pattern Utilization CDR and Genetic Adaptation Algorithms in 7nm CMOS
Ryan Bespalko1, Dustin Dunwell1, James Bailey1, Bo Wang1, Alireza Sharif-Bakhtiar1, Michael O'Farrell1, Kerry Tang1, Anthony Chan Carusone2, David Cassan1, Davide Tonietto3 Huawei Technologies, Toronto, Canada University