ISSCC 2020
Session 5
Image Sensors
A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology
Joo Hyoung Kim, Dongsuk Cho, Taehun Lee, Changkyu Lee, Haeyong Park, Soojin Hong, Chongkwang Chang, Jingyun Kim, Hanjin Lim, Youngsun Oh, Yitae Kim, Seungjoo Nah, Sangill Jung, Jaekyu Lee, JungChak Ahn, Hyeongsun Hong, K
ISSCC 2020
Session 5
Image Sensors
A 2.1e- Temporal Noise and -105dB Parasitic Light Sensitivity Backside-Illuminated 2.3µm-Pixel Voltage-Domain Global Shutter CMOS Image Sensor Using High-Capacity DRAM Capacitor Technology
Taehyoung Kim, Jungchan Kyoung, Dongmo Im, Jinyong Choi, KeunYeong Cho, Daehoon Kim, Haemin Lim, Min-Woong Seo, JuYoung Kim, Doowon Kwon, Jiyoun Song, Jiyoon Kim, Minho Jang, Joosung Moon, HyunChul Kim, Chong Kwang Chang
ISSCC 2020
Session 5
Image Sensors
A Dynamic Pseudo 4-Tap CMOS Time-of-Flight Image Sensor with Motion Artifact Suppression and Background Light Cancelling Over 120klux
Jihoon Park1, Yeonsoo Ahn1, Kihwan Cho1, Jungsoon Shin3, Seung Min Song3, Seong-Jin Kim2, Jung-Hoon Chun1, Jaehyuk Choi1 Sungkyunkwan University, Suwon, Korea Ulsan National Institute of Science and Technology, Ulsan, Ko
ISSCC 2020
Session 5
Image Sensors
An Up-to-1400nm 500MHz Demodulated Time-ofFlight Image Sensor on a Ge-on-Si Platform
C.-F. Liang*, S.-S. Su, M.-J. Yang, C.-Y. Chen, S.-L. Cheng, H.-D. Liu, C.-T. Lin, K. P. Petrov, H.-W. Chen, K.-C. Chu, P.-C. Wu, P.-T. Huang, N. Na, S.-L. Chen Artilux, Hsinchu, Taiwan, *Equally-Credited Authors (ECAs)
ISSCC 2020
Session 5
Image Sensors
A 1200×900 6µm 450fps Geiger-Mode Vertical Avalanche Photodiodes CMOS Image Sensor for a 250m Time-of-Flight Ranging System Using Direct-IndirectMixed Frame Synthesis with Configurable-DepthResolution Down to 10cm
Masato Takemoto, Yugo Nose, Hiroshi Koshida, Masaki Tamaru, Yuki Sugiura, Shigeru Saito, Shinzo Koyama, Mitsuyoshi Mori, Yutaka Hirose, Masayuki Sawada, Akihiro Odagawa, Tsuyoshi Tanaka Panasonic, Nagaokakyo, Japan Long-
ISSCC 2020
Session 5
Image Sensors
A 1280×720 Back-Illuminated Stacked Temporal Contrast Event-Based Vision Sensor with 4.86µm
Thomas Finateu1, Atsumi Niwa2, Daniel Matolin1, Koya Tsuchimoto2, Andrea Mascheroni1, Etienne Reynaud 1, Pooria Mostafalu3, Frederick Brady3, Ludovic Chotard1, Florian LeGoff1, Hirotsugu Takahashi2, Hayato Wakabayashi2,
ISSCC 2020
Session 5
Image Sensors
A 240×192Pixel 10fps 70klux 225m-Range Automotive LiDAR SoC Using a 40ch 0.0036mm2 Voltage/Time Dual-Data-Converter-Based AFE
Masatoshi Hirono3, Tuan Thanh Ta1, Hidenori Okuni1, Shinichi Ohtsuka2, Yoshinari Ojima2, Tomohiko Sugimoto2, Hirotomo Ishii2, Kentaro Yoshioka1, Katsuyuki Kimura2, Akihide Sai1, Nobu Matsumoto2 Toshiba, Kawasaki, Japan T
ISSCC 2020
Session 4
Wireless
A Terahertz FMCW Comb Radar in 65nm CMOS with 100GHz Bandwidth
systems have driven the operation frequency to terahertz (THz) due to the shorter wavelength and larger bandwidth [1-5]. However, conventional single-transceiver FMCW radar chips only provide limited signal bandwidth (<7
ISSCC 2020
Session 4
Wireless
A Single-Antenna W-Band FMCW Radar Front-End Utilizing Adaptive Leakage Cancellation
radars are essential for automotive sensing, medical imaging, and safety- monitoring applications. Among different architectures, frequencymodulated continuous-wave (FMCW) radars are particularly suited for miniature int
ISSCC 2020
Session 4
Wireless
Space-Time Modulated 71-to-76GHz mm-Wave Transmitter Array for Physically Secure Directional Wireless Links
Xi'an Jiaotong University, Xi'an, China *Equally-Credited Authors (ECAs) 1 2 Security in wireless networks has traditionally been addressed above the physical layer. With the expected proliferation of applications in 5G,
ISSCC 2020
Session 4
Wireless
A 64Gb/s 1.4pJ/b/element 60GHz 2×2-Element Phased-Array Receiver with 8b/symbol Polarization MIMO and Spatial Interference Tolerance
multi-user connectivity [1]. Despite this opportunity, throughput of 60GHz phased arrays has been limited to 10.4Gb/s [2-5], and therefore may not offer a substantial performance benefit over the rapidly improving sub-7G
ISSCC 2020
Session 4
Wireless
A 28GHz 4-Element MIMO Beam-Space Array in 65nm CMOS with Simultaneous Spatial Filtering and Single-Wire Frequency-Domain Multiplexing
(ECAs) 1 2 High-data-rate wireless links at mm-wave have motivated the development of scalable, dense arrays with hundreds of elements [1,2]. The evolution from “multiple-input-single-output” phased arrays towards multib
ISSCC 2020
Session 4
Wireless
An E-Band High-Linearity Antenna-LNA Front-End with 4.8dB NF and 2.2dBm IIP3 Exploiting Multi-Feed On-Antenna Noise-Canceling and Gm-Boosting
paradigm to advance front-end innovations and performance beyond electronics-only designs. Instead of being viewed as single-port 50Ω radiation loads, antennas are perceived as multi-feed passive networks interfacing wit
ISSCC 2020
Session 4
Wireless
A 39GHz-Band CMOS 16-Channel Phased-Array Transceiver IC with a Companion Dual-Stream IF Transceiver IC for 5G NR Base-Station Applications
S. Lee, D. Lee, D. Kwon, S. Kim, J. Kim, W. Lee, C. Kim, S. Park, J. Park, B. Suh, J. Jang, M. Kim, D. Minn, I. Park, S. Kim, K. Min, J. Park, S. Jeon, A.-S. Ryu, Y. Cho, S. T. Choi, K. H. An, Y. Kim, J. H. Lee, J. Son,
ISSCC 2020
Session 34
Medical & Bio
EEG Dust: A BCC-Based Wireless Concurrent Recording/Transmitting Concentric Electrode
Institute for Health, Singapore, Singapore 1 2 EEG recording technology creates the opportunity to sense and discover potential fluctuation in the human brain [1]. Quantitative analysis based on various EEG sensor nodes
ISSCC 2020
Session 34
Medical & Bio
Human-Body-Coupled Power-Delivery and AmbientEnergy-Harvesting ICs for a Full-Body-Area Power Sustainability is performed for bulk connection with the VRECT and GND at input amplitude higher than 0.6V, so that the body diode forward biasing is aligned with the conduction path. As a result, at 5V TX swing, 3.5μW power is recovered from ankle to forehead (160cm), successfully covering the whole body.
Miaolin Zhang1, Han Wu1, Lian Zhang1, Joanne Si Ying Tan1, Jerald Yoo1,2 Figure 34.5.4 shows the proposed Dual-Mode Buck-Boost Converter (DM-BBC). Due to the unpredictability of the environmental parasitic and the variat
ISSCC 2020
Session 34
Medical & Bio
A 4.5mm3 Deep-Tissue Ultrasonic Implantable Luminescence Oxygen Sensor
Continuous monitoring of regional tissue oxygenation (RTO) can provide therapeutic guidance for critical care patients. Current technologies for RTO assessment require tethered, wired connections or batteries, creating p
ISSCC 2020
Session 34
Medical & Bio
An 8.2mm3 Implantable Neurostimulator with Magnetoelectric Power and Data Transfer
Amanda Singer, Jacob T. Robinson, Kaiyuan Yang Rice University, Houston, TX *Equally-Credited Authors (ECAs) Modulating the electrical activity in the nervous system has shown great potential for neuroscience research an
ISSCC 2020
Session 34
AI / ML
1225-Channel Localized Temperature-Regulated Neuromorphic Retinal-Prosthesis SoC with 56.3nW/Channel Image Processor
N.1 Institute for Health, Singapore, Singapore 1 2 Retinal prosthesis (RP) electrically stimulates the retinal cells of the blind to restore visual loss, and it is essential to increase the number of channels for higher
ISSCC 2020
Session 34
Medical & Bio
A 64×64 Implantable Real-Time Single-ChargedParticle Radiation Detector for Cancer Therapy
Kavita K. Mishra2, Bruce A. Faddegon2, Michel M. Maharbiz1, Mekhail Anwar2 University of California, Berkeley, CA 2 University of California, San Francisco, CA 1 60% of all cancer treatment requires radiation therapy and
ISSCC 2020
Session 33
Memory
Via-Switch FPGA: 65nm CMOS Implementation and Architecture Extension for AI Applications
Toshitsugu Sakamoto2, Jaehoon Yu1, Ryutaro Doi1, Yusuke Araki3, Hidetoshi Onodera3, Takashi Imagawa4, Hiroyuki Ochi4, Kazutoshi Wakabayashi5, Yukio Mitsuyama6, Tadahiko Sugibayashi2 Osaka University, Suita, Japan, 2NEC,
ISSCC 2020
Session 33
AI / ML
A Fully Integrated Analog ReRAM Based 78.4TOPS/W Compute-In-Memory Chip with Fully Parallel MAC Computing cell is signed quasi-2-bit (3-level) or signed quasi-3-bit (7-level) accordingly.
on-chip ReRAM conductance could be quantified with 256 states at most. Qi Liu1, Bin Gao1, Peng Yao1, Dong Wu1, Junren Chen1, Yachuan Pang1, Wenqiang Zhang1, Yan Liao1, Cheng-Xin Xue2, Wei-Hao Chen2, Jianshi Tang1, Yu Wan
ISSCC 2020
Session 33
Memory
A 74 TMACS/W CMOS-RRAM Neurosynaptic Core with Dynamically Reconfigurable Dataflow and In-situ Transposable Weights for Probabilistic Graphical Models
Yan Liao3, Dabin Wu3, Stephen Deiss2, Bin Gao3, Priyanka Raina1, Siddharth Joshi4, Huaqiang Wu3, Gert Cauwenberghs2, H.-S. Philip Wong1 Stanford University, Stanford, CA, 2University of California, San Diego, CA, Tsinghu
ISSCC 2020
Session 32
Power Management
A Scalable and PCB-Friendly Daisy-Chain Approach to Parallelize LDO Regulators with 2.613% CurrentSharing Accuracy Using Dynamic Element Matching for Integrated Current Sensing
applications presents a challenge for chip-level thermal management and also tends to be inefficient. Straightforward parallelizing of LDOs to increase output current is a flawed approach since subtle variations between
ISSCC 2020
Session 32
Power Management
A 0.4-to-1.2V 0.0057mm2 55fs-Transient-FoM RingAmplifier-Based Low-Dropout Regulator with Replica-Based PSR Enhancement
Digital low-dropout regulators (DLDOs) are commonly used in low-power systemon-chips (SoCs) because of their low-voltage operation and fast transient response via the digital control of a power gate. However, the digital
ISSCC 2020
Session 32
Power Management
Electromagnetic Mechanical Energy-Harvester IC with No Off-Chip Component and One Switching Period MPPT Achieving up to 95.9% End-to-End Efficiency and 460% Energy-Extraction Gain
from sub-g vibrational environments while having a volume of a few cm3. Thus, such EMHs are promising candidates for powering net-zero-power sensor nodes as compared to their electrostatic- or piezoelectric-based counter
ISSCC 2020
Session 32
Power Management
Self-Tunable Phase-Shifted SECE Piezoelectric EnergyHarvesting IC with a 30nW MPPT Achieving 446% Energy-Bandwidth Improvement and 94% Efficiency
extraction capability of piezoelectric energy harvesters (PEHs), the quality factor of mechanical resonators should be maximized over the extraction-energy frequency bandwidth (EFB). As a result, the EFB is often limited
ISSCC 2020
Session 32
Power Management
A 13.56MHz Current-Mode Wireless Power and Data Receiver with Efficient Power Extracting Controller and Energy-Shift Keying Technique for Loosely Coupled Implantable Devices Sung-Wan Hong
attractive solution. There are two types of WPT receivers (RXs), voltage-mode (VM) RX [1], [2] and current-mode (CM) RX [3], [4]. The VM-RX is suitable when the coupling coefficient (k12) between the transceiver (TX) and
ISSCC 2020
Session 31
Digital Circuits
A Compute-Adaptive Elastic Clock-Chain Technique with Dynamic Timing Enhancement for 2D PE-Array-Based Accelerators
Dynamic timing error detection and correction techniques, e.g. razor flops, have been previously applied to microprocessors to exploit the dynamic timing margin within pipelines [1]. Adaptive clock techniques have also b
ISSCC 2020
Session 31
AI / ML
CIM-Spin: A 0.5-to-1.2V Scalable Annealing Processor Using Digital Compute-In-Memory Spin Operators and Register-Based Spins for Combinatorial Optimization Problems
*Equally-Credited Authors (ECAs) Annealing processors [1-3] based on the convergence property of the Ising model offer an attractive means for solving combinatorial optimization problems [4]. A recently developed anneali
ISSCC 2020
Session 31
Digital Circuits
A 65nm 8.79TOPS/W 23.82mW Mixed-Signal OscillatorBased NeuroSLAM Accelerator for Applications in Edge Robotics
Simultaneous localization and mapping (SLAM) is a quintessential problem in cyber-physical systems with wide-spread applications in mobile robotics, selfdriving vehicles, AR, VR, etc. While computational methods [1] and
ISSCC 2020
Session 30
Wireless
A 3.5mm×3.8mm Crystal-Less MICS Transceiver Featuring Coverages of ±160ppm Carrier Frequency Offset and 4.8-VSWR Antenna Impedance for Insertable Smart Pills
Gaurav Singh1, Peng Zhang1, Stefano Traferro1, Hannu Korpela1, Nick van Helleputte3, Robert Bogdan Staszewski2, Yao-Hong Liu1, Christian Bachmann1 imec-Netherlands, Eindhoven, The Netherlands University College Dublin, D
ISSCC 2020
Session 30
Wireless
A Crystal-Less BLE Transmitter with -86dBm FrequencyHopping Back-Channel WRX and Over-the-Air Clock Recovery from a GFSK-Modulated BLE Packet packet, meaning the TX LO is ready before the end of the ADV event. 8MHz also relaxes the required BPF center frequency and quality factor. Using two LOs allows for receiving and transmitting on different BLE channels and for optimizing each PLL controller.
Benton H. Calhoun2, David D. Wentzloff1 Figure 30.7.3 shows a simplified block diagram for both PLLs for reference recovery from the BLE packet and TX transmission. It is a type-I ADPLL with an embedded averaging process
ISSCC 2020
Session 30
Wireless
A 0.5V BLE Transceiver with a 1.9mW RX Achieving -96.4dBm Sensitivity and 4.1dB Adjacent Channel Rejection at 1MHz Offset in 22nm FDSOI
Hironori Nakahara1, Norihito Suzuki1, Yutaka Nakada1, Yusuke Shinohe1, Shinichirou Etou1, Tetsuya Fujiwara2, Yasushi Katayama1 Sony Semiconductor Solutions, Atsugi, Japan Sony LSI Design, Atsugi, Japan 1 2 Towards the em
ISSCC 2020
Session 30
Wireless
A 370µW 5.5dB-NF BLE/BT5.0/IEEE 802.15.4-Compliant Receiver with >63dB Adjacent Channel Rejection at >2 Channels Offset in 22nm FDSOI
Analog Devices, Cork, Ireland 1 2 Upcoming Internet-of-Things (IoT) applications require low-power multi-standard RF receiver (RX) front-ends. Interference rejection becomes increasingly important as ever more devices co
ISSCC 2020
Session 30
Wireless
A SAW-Less NB-IoT RF Transceiver with Hybrid Polar and On-Chip Switching PA Supporting Power Class 3 Multi-Tone Transmission
communication technology that benefits from the advantages of both cellular networks and narrowband transmission. Since the NB-IoT specification was finalized by 3GPP in 2016, several SoCs [1,2] and an RF transceiver [3]
ISSCC 2020
Session 30
Wireless
NB-IoT and GNSS All-in-One System-on-Chip Integrating
Low-Cost Solution Jongsoo Lee, Jaeyeol Han, Chilun Lo, Jongmi Lee, Wan Kim, Seungjin Kim, Byoungjoong Kang, Juyoung Han, Sangdon Jung, Takahiro Nomiyama, Jongwoo Lee, Thomas Byunghak Cho, Inyup Kang Samsung Electronics,
ISSCC 2020
Session 30
Wireless
A Temperature-Robust 27.6nW -65dBm Wakeup Receiver at 9.6GHz X-Band
Benton H. Calhoun, Steven M. Bowers University of Virginia, Charlottesville, VA To achieve the exponential growth needed for a 1-trillion-node Internet of Things (IoT) in the next decade, innovative solutions are require
ISSCC 2020
Session 3
Analog Circuits
A 23.6ppm/°C Monolithically Integrated GaN Reference Voltage Design with Temperature Range from -50°C to 200°C and Supply Voltage Range from 3.9 to 24V
Kai-Cheng Chung1, Neha Kumari1, Ke-Horng Chen1, Yin-Hsi Lin2, Shian-Ru Lin2, Tsung-Yen Tsai2, Ying-Zong Juang3 National Chiao Tung University, Hsinchu, Taiwan Realtek Semiconductor, Hsinchu, Taiwan 3 Taiwan Semiconductor
ISSCC 2020
Session 3
Analog Circuits
A 620µW BJT-Based Temperature-to-Digital Converter with 0.65mK Resolution and FoM of 190fJ·K2
(TDC) are used for temperature compensation of high-stability MEMS oscillators [1,2]. Such TDCs must achieve high resolution and high conversion rates in the kHz range to minimize temperature compensation impact on phase
ISSCC 2020
Session 3
Analog Circuits
A CMOS Resistor-Based Temperature Sensor with a 10fJ∙K2 Resolution FoM and 0.4°C (3σ) Inaccuracy From −55°C to 125°C After a 1-point Trim
Energy efficiency and accuracy are important specifications of CMOS temperature sensors. BJT-based sensors achieve state-of-the-art accuracy [1], while Wheatstone-bridge (WhB) sensors achieve lower accuracy but state-of-
ISSCC 2020
Session 3
Analog Circuits
A 34µW 32MHz RC Oscillator with ±530ppm Inaccuracy from -40°C to 85°C and 80ppm/V Supply Sensitivity Enabled by Pulse-Density Modulated Resistors
University of Illinois, Urbana, IL Monolithic frequency references built using on-chip time constants are gaining popularity as possible replacements to bulky quartz-crystal or MEMS-based oscillators in low-cost applicat
ISSCC 2020
Session 3
Analog Circuits
A 16MHz CMOS RC Frequency Reference with ±400ppm Inaccuracy from -45°C to 85°C After Digital Linear Temperature Compensation
Systems-on-chip traditionally rely on bulky quartz crystals to comply with wired communication standards like CAN or USB 2.0. Integrated frequency references with better than 500ppm inaccuracy could meet this need, resul
ISSCC 2020
Session 3
Analog Circuits
A 0.51nW 32kHz Crystal Oscillator Achieving 2ppb Allan Deviation Floor Using High-Energy-to-Noise-Ratio Pulse Injection
minimum power while disturbing the oscillation as little as possible. In order to achieve subnW power consumption, there are three fundamental considerations: the loss in the crystal, the efficiency of energy injection,
ISSCC 2020
Session 3
Analog Circuits
A 0.0088mm2 Resistor-Based Temperature Sensor Achieving 92fJ·K2 FoM in 65nm CMOS
University of Illinois, Urbana, IL Resistor-based temperature sensors can achieve superior performance in terms of energy efficiency and resolution compared to their BJT counterparts. Among them, Wien- (WB)[1]- and Wheat
ISSCC 2020
Session 3
Analog Circuits
An Integrated BAW Oscillator with <±30ppm Frequency
Danielle Griffith1, Ernest Ting-Ta Yen2, Kaichien Tsai1, Habeeb Ur Rahman Mohammed1, Baher Haroun1, Ali Kiaei2, Ahmad Bahai2 Texas Instruments, Dallas, TX; 2Texas Instruments, Santa Clara, CA 1 Wireless sensor nodes with
ISSCC 2020
Session 29
RF & Wireless
A 4×4 Distributed Multi-Layer Oscillator Network for Harmonic Injection and THz Beamforming with 14dBm EIRP at 416GHz in a Lensless 65nm CMOS IC
applications in communication, sensing, imaging, and spectroscopy [1]. However, due to the limited power-generation capability of a single source above the device fmax [2], efficient spatial power combining from multiple
ISSCC 2020
Session 29
RF & Wireless
THzID: A 1.6mm2 Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz
Chiraag S. Juvekar2, Wanyeong Jung1, Rabia Tugce Yazicigil3, Anantha P. Chandrakasan1, Ruonan Han1 Massachusetts Institute of Technology, Cambridge, MA Analog Devices, Boston, MA 3 Boston University, Boston, MA 1 2 Energ
ISSCC 2020
Session 29
RF & Wireless
A 490GHz 32mW Fully Integrated CMOS Receiver Adopting Dual-Locking FLL
increasing demand for low-cost, low-power, and high-sensitivity THz receiver. Lately, heterodyne structures in CMOS technologies have been emerging as suitable solutions due to their advantages of low cost, high integrat
ISSCC 2020
Session 29
RF & Wireless
A 660-to-676GHz 4×2 Oscillator-Radiator Array with Intrinsic Frequency-Filtering Feedback for Harmonic Power Boost Achieving 7.4dBm EIRP in 40nm CMOS
The THz region of the electromagnetic spectrum is gaining interest due to its unique spectroscopic properties that make it useful for gas detection, biological imaging, and accurate timekeeping. While several techniques