Papers 2008–2026

Van Butler1,2, Raymond Kim3, Ramon Rodriguez1, Tom Maffitt4, Joseph J. Oler1, John Goss1, Christopher Parkinson5,6, Michael A. Ziegerhofer1, Steven Burns1 Globalfoundries, Essex Junction, VT Green Mountain Semiconductor,

Johnny Yang2, Hau-Tai Hsieh2, Frank Wu2, Jung-Ping Yang2, Atul Katoch3, Arun Achyuthan3, Donald Mikan1, Bryan Sheffield1, Jonathan Chang2 TSMC Design Technology, Austin, TX TSMC Design Technology, Hsinchu, Taiwan 3 TSMC

Changnam Park, Minsun Hong, Giyong Yang, Jeongho Do, Jinyoung Lim, Seungyoung Lee, Ingyum Kim, Sanghoon Baek, Jonghoon Jung, Daewon Ha, Hyungsoon Jang, Taejung Lee, Chul-Hong Park, Bongjae Kwon, Hyuntaek Jung, Sungwee Ch

Hank Cheng1, Hidehiro Fujiwara1, Jih-Yu Lin1, Kao-Cheng Lin1, John Hung1, Robin Lee1, Hung-Jen Liao1, Jhon-Jhy Liaw2, Quincy Li2, Chih-Yung Lin2, Mu-Chi Chiang2, Shien-Yang Wu2 TSMC Design Technology, Hsinchu, Taiwan TSM

Doo-Hyun Kim, Daewoon Kang, Sunghoon Lee, Ji-Sang Lee, Wontae Kim, Jiyoon Park, Yang-lo Ahn, Jiyoung Lee, Jong-hoon Lee, Seungbum Kim, Hyun-Jun Yoon, Jaedoeg Yu, Nayoung Choi, Yelim Kwon, Nahyun Kim, Hwajun Jang, Jonghoo

breakdown as a programming scheme is fabricated and characterized. The antifuse OTP bitcell is composed of an NMOS as antifuse element and as a select transistor. Characterization shows that this solution is a viable tec

Jingcheng Wang1, Kaiyuan Yang1, Yen-Po Chen1, Junjie Dong1, Minchang Cho1, Gyouho Kim1, Wei-Keng Chang2, Yun-Sheng Chen2, Yu-Der Chih2, David Blaauw1, Dennis Sylvester1 University of Michigan, Ann Arbor, MI TSMC, Hsinchu

Toshio Yamamura2, Hiroyuki Mizukoshi1, Shingo Zaitsu1, Minoru Yamashita1, Shunichi Toyama1, Norihiro Kamae1, Juan Lee1, Shuo Chen1, Jiawei Tao1, William Mak1, Xiaohua Zhang1, Ying Yu1, Yuko Utsunomiya2, Yosuke Kato1, Man

Switching power converters with fast load transients are crucial for application processors (APs) to facilitate system-level power adaptability with high current slew rate. While current-mode hysteretic control has been

Fast load-transient responses are crucial for DC-DC converters to cope with the demands of modern highly integrated system-on-chip (SoC) designs. Various techniques have been proposed to improve transient responses by en

devices below 28nm allow supply voltages lower than 1V. For applications with higher input voltage in such devices, stacked MOSFET structures with a three-level technology are commonly employed. The stacked structure can

Each mobile device is usually equipped with a Li-ion battery having voltage that varies from a minimum of 2.7V to a maximum of 4.2V. Therefore, as the battery voltage decreases with time, a DC-DC converter is required fo

University of Illinois, Urbana, IL Owing to the need for low power consumption, portable and wearable electronics operate at low voltages, typically below 1V, with recent designs in near- and subthreshold operation resul

Intel, Hillsboro, OR 3 Hive Battery, Seattle, WA 1 2 With the growing adoption of electrified transportation and need for active storage in the electrical grid, electrochemical energy storage has become increasingly impo

Over the past years, delivering power to integrated circuits has become increasingly difficult. With the current intake of many modern-day applications growing each new process generation, the Power Delivery Network (PDN

1. Overview Quantum computers have the potential to tackle problems in materials science, chemistry, and mathematics that are well beyond the reach of supercomputers. Their power derives from the use of quantum bits, whi

that biological information was encoded in DNA as a sequence of chemical building-block “letters”, developing technology for reading (or “sequencing”) this chemical code has been fundamental to advances in biology and me

1.1 Introduction Scaling of CMOS, the technology that has driven our industry for 45 years and prompted unprecedented innovations in device, circuit, and manufacturing, is coming to an end. There is no unanimous agreemen

Industry application trends have seen important usage-model shifts from the PC era to the mobile-computing era, where individuals have moved from possessing one device to multiple devices that connect them to people [1].

Full-duplex (FD) is an emergent wireless communication paradigm where the transmitter (TX) and the receiver (RX) operate at the same time and at the same frequency. The fundamental challenge with FD is the tremendous amo

-246.6dB-FOM, Fractional-N Subsampling PLL Nereo Markulic1,2, Kuba Raczkowski1, Ewout Martens1, Pedro Emiliano Paro Filho1,2, Benjamin Hershberg1, Piet Wambacq1,2, Jan Craninckx1 imec, Leuven, Belgium, Vrije Universiteit

Dimitris Papadopoulos1, Bryan Huang1, Ray Chen1, Hua Wang1, WH Hsu2, CH Wu2, Osama Shanaa1 MediaTek, San Jose, CA, MediaTek, Hsinchu, Taiwan 1 2 Digital transmitters (DTX) have gained interest in the past few years becau

Renaldi Winoto1, Ashkan Olyaei1, Mohammad Hajirostam1, Wai Lau1, Xiang Gao1, Arnab Mitra1, Ovidiu Carnu1, Philip Godoy1, Luns Tee1, Hao Li1, Erdem Erdogan1, Alden Wong1, Qiang Zhu1, Timothy Loo1, Fan Zhang1, Liwei Sheng1

To meet the demands of ever-increasing data throughput, carrier aggregation (CA) across frequency bands is becoming necessary. Different regional spectrum allocations lead to a large number of band combinations and chall

Oregon State University, Corvallis, OR 1 2 Multiple-antenna receivers offer numerous advantages over single-antenna receivers, including sensitivity improvement, ability to reject interferers spatially and enhancement of

S. Uppathil1, S. Kaylor1, A. Akour1, V. Wang1, M. Fares1, F. Dulger1, A. Frank1, D. Ghosh1, S. Madhavapeddi1, H. Safiri1, J. Mehta1, A. Jain1, H. Choo1, E. Zhang1, C. Sestok1, C. Fernando1, Rajagopal K.A. 2, S. Ramakrish

M. Alioto2, D. Blaauw1, D. Sylvester1 University of Michigan, Ann Arbor, MI, National University of Singapore, Singapore, Singapore 1 2 It is well known that technology scaling has led to increasing process/voltage/tempe

keys or chip IDs based on intrinsic properties of each chip itself [1-2]. PUFs are a step forward to improve the security level compared to traditional NVM (nonvolatile memory) solutions (FUSEs, EEPROM/FLASH, etc.) becau

Stephen G. Tell1, Thomas H. Greer III1, C. Thomas Gray1, William J. Dally2 Nvidia, Durham, NC, 2Nvidia, Santa Clara, CA 1 Signaling over chip-scale global interconnect is consuming a larger fraction of total power in lar

Seokhyeon Jeong1, Kaiyuan Yang1, Myungjoon Choi1, ZhiYoong Foo1, Suyoung Bang1, Sechang Oh1, Dennis Sylvester1, David Blaauw1 University of Michigan, Ann Arbor, MI, 2Korea University, Seoul, Korea 1 As Internet-of-Things

circuits to lower intrinsic VMIN, retention flops to reduce leakage power during stall periods, and a fully integrated hybrid digital LDO/SCVR regulator to provide a cost-effective means to realize autonomous DVFS under

Tae-Hwang Kong2, Dae-Yong Kim2, Kwang-Ho Kim2, Sang-Ho Kim2, Jae-Jin Park2, Ho-Jin Park2, Gyu-Hyeong Cho1 KAIST, Daejeon, Korea, Samsung Electronics, Hwaseong, Korea 1 2 A modern mobile application processor (AP) require

Modern SoC designs employ a number of power domains, many of which are often implemented by low-drop-out (LDO) regulators. The key overhead of the existing LDO design is the large off-chip output capacitor (Cout) for com

Christian Bernard1, Florian Darve1, Didier Lattard1, Ivan Miro-Panades1, Cristiano Santos1, Fabien Clermidy1, Severine Cheramy1, Frederic Petrot2, Eric Flamand3, Jean Michailos4 CEA-LETI-MINATEC, Grenoble, France, Tima L

Koichi Kawai1, Jae-Kwan Park2, Shigekazu Yamada1, Feng Pan2, Yuichi Einaga1, Ali Ghalam2, Toru Tanzawa1, Jason Guo2, Takaaki Ichikawa1, Erwin Yu2, Satoru Tamada1, Tetsuji Manabe1, Jiro Kishimoto1, Yoko Oikawa1, Yasuhiro

Takashi Hashimoto2, Hideaki Yamakoshi2, Shinichiro Abe2, Takashi Kono1, Yasuhiko Taito1, Takashi Ito1, Takashi Krafuji1, Kenji Noguchi1, Hideto Hidaka1, Tadaaki Yamauchi1 Renesas Electronics, Kodaira, Japan, Renesas Elec

Sung-won Yun, Min-su Kim, Jong-hoon Lee, Minseok Kim, Kangbin Lee, Taeeun Kim, Byungkyu Cho, Dooho Cho, Sangbum Yun, Jung-no Im, Hyejin Yim, Kyung-hwa Kang, Suchang Jeon, Sungkyu Jo, Yang-lo Ahn, Sung-Min Joe, Suyong Kim

Yen-Ning Chiang1, Hsiang-Jen Tsai3, Geng-Hau Yang3, Ya-Chin King1, Chrong Jung Lin1, Tien-Fu Chen3, Meng-Fan Chang1 National Tsing Hua University, Hsinchu, Taiwan, TSMC, Hsinchu, Taiwan, 3 National Chiao Tung University,

Tzu-Hsiang Su1,3, Keng-Hao Yang3, Tien-Fu Chen3, Tien-Yen Wang1, Hsiang-Pang Li1, Matthew BrightSky4, SangBum Kim4, Hsiang-Lam Lung1, Chung Lam4 Macronix International, Hsinchu, Taiwan, National Tsing Hua University, Hsi

Keiichi Kushida1, Atsushi Kawasumi1, Hiroyuki Hara1, Keiko Abe1, Naoharu Shimomura1, Junichi Ito1, Shinobu Fujita1, Takashi Nakada2, Hiroshi Nakamura2 Toshiba, Kawasaki, Japan, University of Tokyo, Tokyo, Japan 1 2 Two p

Yong Sung Cho, Kyung-Tae Kang, Jinho Ryu, Kyung-Min Kang, Sungyeon Lee, Wandong Kim, Hanjun Lee, Jaedoeg Yu, Nayoung Choi, Dong-Su Jang, Jeong-Don Ihm, Doogon Kim, Young-Sun Min, Moo-Sung Kim, An-Soo Park, Jae-Ick Son, I

Hiroshi Shimamoto1, Tomohiko Kosugi2, Sungwook Jun2, Satoshi Aoyama2, Ming-Chieh Hsu3, Yuichiro Yamashita3, Hirofumi Sumi3, Shoji Kawahito2,4 NHK Science & Technology Research Laboratories, Tokyo, Japan, Brookman Technol

image sensors. In addition, 3D stacking separates pixel array and peripheral circuits. As such, computational imaging blocks (stereo vision, array camera, reconfigurable instruction cell array, etc.) can integrate with s

2e-, 3D-stacked CMOS image sensor (CIS) for mobile applications. A key motivation for using a stacked configuration is to minimize the chip area. Also, since numerous components must be integrated into the bottom chip, a

sensors such as camcorders, digital still cameras, mobile phones, and surveillance cameras. Even though leading-edge image sensors have reached the noise floor of a few electrons [1,2], a thrust towards darker levels sti

Recent technology surveys identified flash light detection and ranging technology as the best choice for the navigation and landing of spacecrafts in extraplanetary missions, working from single-point altimeter to range-

Daisuke Yoshida, Yasushi Matsuno, Masanobu Ohmura, Hidekazu Takahashi, Katsuhito Sakurai, Takeshi Ichikawa, Hiroshi Yuzurihara, Shunsuke Inoue Canon, Kawasaki, Japan Recently, there has been strong demand for high-resolu

Bart Ceulemans, Guy Meynants, Navid Sarhangnejad, Gavril Arsinte, Victor Statescu, Sonja van der Groen CMOSIS NV, Antwerp, Belgium In today’s airborne mapping applications, there is a strong push towards higher-resolutio

in-vehicle cameras, and surveillance cameras require a global shutter (GS) function. GS functions are an increasingly powerful technology driver, not only for solving imaging problems caused by rolling shutter distortion

Masaaki Yanagida, Tokuhiko Tamaki, Masayuki Takase, Hidenari Kanehara, Masashi Murakami, Yasunori Inoue Panasonic, Moriguchi, Japan Image sensors are increasingly becoming key devices for various applications (in-vehicle