ISSCC 2025
Session 3
Analog Circuits
A Passive Switched-Capacitor-Based Multimode Amplifier with a Logarithmic Conformity Error of 0.75% from -25 to 200°C
requires integrated electronics to endure harsh environments with temperatures up to 200°C. Acoustic sensors (e.g., piezoelectric) detect environmental composition, as illustrated in Fig. 3.3.1 (top). Due to the natural
ISSCC 2025
Session 3
Analog Circuits
A 36V Current-Balancing Instrumentation Amplifier with ±24V
amplifiers (HV-IAs) are employed to process millivolt-level signals from sensors and standardized 4-to-20mA current signals from transmitters [1,2]. The latter are converted into voltage signals up to 10V via a 250Ω or 5
ISSCC 2025
Session 29
Memory
A 3nm 3.6GHz Dual-Port SRAM with Backend-RC Optimization and a Far-End Write-Assist Scheme
Cheng-Han Lin1, Shan-Ru Liao1, Kenta Torigoe2, Shirleen Xia3, Yuichiro Ishii3, Yao-Yi Liu1, Jhon-Jhy Liaw1, Yen-Huei Chen1, Hung-Jen Liao1, Tsung-Yung Jonathan Chang1 TSMC, Hsinchu, Taiwan TSMC Design Technology Japan, O
ISSCC 2025
Session 29
Memory
A 38Mb/mm2 380/540mV Dual-Rail SRAM in 3nm-FinFET Technology its leakage is eliminated and INCM returns to VDDA to stop P1 leakage. When opaque LCLKT is at VDDA and the cross-coupled NMOS/PMOS latch is enabled; input switching does not propagate to the output until the latch is transparent.
Prasanna Nalawar4, Yogeshbhai Patel2, Shailendra Sharad2, Shakti Singh2 A clock buffer with high-voltage LS bypass is shown in Fig. 29.4.3, its design supports an extended voltage range when a large forward split is appl
ISSCC 2025
Session 29
Memory
A 3nm FinFET 2.2Gsearch/s 0.305fJ/b TCAM with Dynamically Gated Search Lines for Data-Center ASICs
classification and forwarding are fundamental tasks for data-center network (DCN) components, such as switches and routers, which are used to efficiently manage and direct network traffic. Packet classification involves
ISSCC 2025
Session 29
Memory
A 0.021μm2 High-Density SRAM in Intel-18A-RibbonFET Technology with PowerVia-Backside Power Delivery
Kaushal Dave1, Arash Joushaghani1, Narae Kang1, Minwoo Ko1, Anandkumar Mahadevan Pillai2, Hema Chandra Prakash Movva1, Gyusung Park1, Muktadir Rahman1, Seenivasan Subramaniam1, Vinay Vashishtha1, Teng Yang1, Zheng Guo1,
ISSCC 2025
Session 29
Memory
A 38.1Mb/mm2 SRAM in a 2nm-CMOS-Nanosheet Technology for High-Density and Energy-Efficient Compute
Teja Masina, Kuo-Cheng Lin, Po-Sheng Wang, Yangsyu Lin, Chih-Yu Lin, Yi-Hsin Nien, Hidehiro Fujiwara, Ku-Feng Lin, Ming-Hung Chang, Ching Wei Wu, Robin Lee, Yih Wang, Hung-Jen Liao, Quincy Li, Ping Wei Wang, Geoffrey Yea
ISSCC 2025
Session 28
Sensors
A 143dB-Dynamic-Range 119dB-CMRR Capacitance-to-Digital Converter for High-Resolution Floating-Target Displacement Sensing
systems [1-4]. Compared to eddy-current displacement sensors [1], capacitive displacement sensors are potentially more energy efficient [2-4]. However, they are more susceptible to electric-field interferences on an elec
ISSCC 2025
Session 28
Sensors
A 185.2dB-FoMs 8.7aFrms Zoomed Capacitance-to-Digital Converter with Chopping-Based kT/C Noise Cancellation and Add-Then-Subtract Phase-Domain Lead-Compensation Technique
traditional lowspeed fields, such as measuring pressure [1] and humidity [2], to real-time applications like robotics and drones. E.g., high-performance MEMS motion-tracking devices feature a short measurement time of 31
ISSCC 2025
Session 28
Sensors
A 189.3dB-FoMS 14.5fJ/Conversion-Step Continuous-Time Noise-Shaping SAR Capacitance-to-Digital Converter
capacitance-to-digital converters (CDCs) have attracted significant attention in IoT applications to monitor environmental conditions such as humidity [1-3] and pressure [3-5]. One of the key challenges is how accurately
ISSCC 2025
Session 28
Sensors
An 18.5nF-Input-Range PM-SAR-Hybrid Capacitance-to-Digital Converter Achieving 6.1µs Conversion Time at 18.1pF Input Capacitance
S-OSC and R-OSC (S-DIV and R-DIV) derive a time difference ∆TSU+N·∆T, which is then converted to ∆VSU+∆V and D2[k] in the same manner. Finally, the kth C2D conversion result DLSB[k] is obtained as D1[k]%D2[k], so it cont
ISSCC 2025
Session 27
RF & Wireless
A BJT-Based Temperature Sensor with an 80fJ∙K2 Resolution FoM
BJT-based temperature sensors are widely used because they can achieve a high accuracy after applying a low-cost 1-point trim. In terms of energy efficiency, however, they are still outperformed by resistor-based sensors
ISSCC 2025
Session 27
RF & Wireless
A Sub-1V 14b 5.8nW/Hz BW/Power-Scalable CT Sensor Interface with a Frequency-Controlled Current Source Achieving a 225× Scalable Range
Vango Technologies, Hangzhou, China 1 2 Precision and energy-efficient sensor interfaces have always been needed in IoT applications. To digitize weak signals (tens of mVs), such as shunt-based current and biomedical sen
ISSCC 2025
Session 27
RF & Wireless
A Voltage-Biased CMOS Hall Sensor with 1.0µT (3σ) Offset and a 60nT/√Hz Noise-Floor
Tsinghua University, Beijing, China 1 2 Hall sensors are the only CMOS devices capable of measuring DC magnetic fields and so they are used in a wide range of applications, such as in compasses and current sensors. In su
ISSCC 2025
Session 27
RF & Wireless
A 3-Axis MEMS Gyroscope with 2.8ms Wake-Up Time Enabled by a 1.5µW Always-On Drive Loop
mobile and wearable devices with human-machine interfaces for motion detection and indoor navigation [1-5]. In these applications, the always-on mode (i.e., standby or suspend mode) is required to support event-driven op
ISSCC 2025
Session 26
Wireless
A 17.7-to-29.5GHz Transceiver Front-End with 3.3dB NF and 20.2dBm OP1dB in 65nm CMOS
Shanghai, China 4 Georgia Institute of Technology, Atlanta, GA 1 2 To support various emerging applications, such as 5G millimeter-wave (mm-wave) communications, low-earth-orbit (LEO) satellite communication (SATCOM), an
ISSCC 2025
Session 26
Wireless
A 24-to-29GHz Compact Transmit/Receive Front-End Module Featuring an Asymmetric Doherty Power Amplifier and 0.22mm2 Area
*Equally Credited Authors (ECAs) The performance of mm-wave beamformers is largely determined by the front-end module (FEM), which integrates a power amplifier (PA), a low-noise amplifier (LNA), and a transmit/receive (T
ISSCC 2025
Session 26
Wireless
A Crystal-less Frequency-Modulation Transmitter IC with Joint Neural-Network-Driven Modulation and Coding for Low-Power Connectivity
wireless communication solutions remain critical for applications like smart-home automation and wearable health monitors. While IoT gateways can provide high-performance RF transceivers and powerful digital processors f
ISSCC 2025
Session 26
Wireless
A Wideband Replicas-Rejection Digital Transmitter Using Joint-Digital-Analog Interpolation and Filtering in 28nm CMOS
*Equally Credited Authors (ECAs) There are multiple wireless communication standards in the crowded sub-6GHz band and the trend of data throughputs is continuously increasing. In the last few years, digital transmitters
ISSCC 2025
Session 26
Wireless
A 24GHz Direct Digital Transmitter Using Multiphase Subharmonic Switching PA Achieving 3.2Gb/s Data Rate and -30.8dB EVM in 65nm CMOS
employment of K/Ka-band for sensing and communication purposes, such as 5G systems and radar applications, has gained increasing interest. These systems commonly make use of an array of transmitters (TX) and antennas, ea
ISSCC 2025
Session 25
Other
A 99.5mW/port DC-to-40GHz Integrated Channel Analyzer for High-Density Signal Integrity Measurement in 28nm CMOS
Beijing, China 1 2 *Equally Credited Authors (ECAs) The growing demand for higher network bandwidth has led to a significant rise in channel density within Ethernet switches and high-performance computers. As data rates
ISSCC 2025
Session 25
Other
A Micromachined Heterogeneously Integrated Active-Probe Enabling Non-Disruptive In-Situ Measurements from DC to 50GHz
integrated microsystems becomes increasingly difficult as these systems scale in size and speed. These interfaces are tight pitch and parasitic sensitive, limiting the use of traditional (50Ω) test equipment. A microscal
ISSCC 2025
Session 25
Other
AI-Enabled Design Space Discovery and End-to-end Synthesis for RFICs with Reinforcement Learning and Inverse Methods Demonstrating mm-Wave/sub-THz PAs between 30 and 120GHz
AI-enabled algorithmic flow for architecture discovery, circuit topology and parameter optimization for RFICs, particularly exploring design spaces beyond human intuition. RF and mmWave IC design is a complex iterative d
ISSCC 2025
Session 25
Other
A 4GS/s Fully Analog 256×256 MP-Based Cross-Correlator with 1000TOPS/W Compute Efficiency and 1.3TOPS/mm2 Compute Density in 22nm SOI CMOS
Louis, Saint Louis, MO Oregon State University, Corvallis, OR 3 University of California, San Diego, CA 4 Northeastern University, Oakland, CA 1 2 Multi-lag cross-correlations (X-Corr) are essential building blocks in ra
ISSCC 2025
Session 25
Other
A Physics-Inspired Oscillator-Based Mixed-Signal Optimization Engine for Solving 50-Variable 218-Clause 3-SAT Problems with 100% Solvability and 31.7μs Solution Time
Zhengya Zhang, Michael P. Flynn University of Michigan, Ann Arbor, MI *Equally Credited Authors (ECAs) The Boolean satisfiability (SAT) problem is a fundamental NP-complete problem, and efficiently solving it would revol
ISSCC 2025
Session 24
Data Converters
A 12GS/s 9b 16× Time-Interleaved SAR ADC in 16nm FinFET
Michael Elliott4, Stuart McCracken1, Jack Kenney2, Janet Brunsilius3, Anil Korkmaz5, Enrique Alvarez Fontecilla3, Nevena Rakuljic3, Ushma Mehta3, Ben Sullivan1, Jeremy Scuteri5, Bac Binh Luu3, Mitchell Nichols3, Dara Mar
ISSCC 2025
Session 24
Data Converters
An 8b 10GS/s 2-Channel Time-Interleaved Pipelined ADC with
Yunsong Tao, Mingtao Zhan, Mingyang Gu, Xiyu He, Yuxuan He, Zhishuai Zhang, Yi Zhong, Lu Jie, Nan Sun Tsinghua University, Beijing, China High-speed (~10GS/s) medium-resolution (~8b) ADCs are key blocks for wideband appl
ISSCC 2025
Session 24
Data Converters
A Power- and Area-Efficient 4nm Self-Calibrated 12b/16GS/s Hierarchical Time-Interleaving ADC
Tsun-Yuan Fan1, Alec Chin1, Tsung-Chih Hung1, Jonathan X Wu2, Chi-Lun Lo2, Andy Pan1, Ming-Hang Hsieh1, Yun-Shiang Shu1, Wei-Hsin Tseng1, Kuan-Dar Chen1 MediaTek, Hsinchu, Taiwan MediaTek, Woburn, MA 1 Each sub-ADC, cloc
ISSCC 2025
Session 24
Data Converters
A 72GS/s 9b Time-Interleaved Pipeline-SAR ADC Achieving 55.3/49.3dB SFDR at 20GHz/Nyquist Inputs in 16nm FinFET
traffic have driven optical modules to scale beyond 100Gb/s. This evolves aggressive bandwidth and SNDR frontiers for their ADCs in the receiver to cope with advanced modulations and oversampling rates. Time-interleaving
ISSCC 2025
Session 24
Data Converters
A 10b 3GS/s Time-Domain ADC with Mutually Exclusive Metastability Correction and Wide Common-Mode Input
unpredictable and non-Gaussian error behaviors in the A/D conversion, which cannot be tolerated by applications such as lowbit-error-rate serial link receivers, radar, and instrumentation [1-5]. Time-domain (TD) ADCs [6-
ISSCC 2025
Session 24
Data Converters
A PVT-Robust 2× Interleaved 2.2GS/s ADC with Gated-CCRO-Based Quantizer Shared Across Channels and Steps Achieving >4.5GHz ERBW
Instituto Superior Tecnico/University of Lisboa, Lisbon, Portugal 1 The demand for medium-resolution GS/s ADCs is increasing in DSP-based wireline communication. Enhancing energy and area efficiency of the unit ADC is cr
ISSCC 2025
Session 24
Data Converters
A 14b 1GS/s Single-Channel Pipelined ADC with a Parallel-Operation SAR Sub-Quantizer and a DynamicDeadzone Ring Amplifier
and high resolution (&14b) are required for wireless communication and instrumentation applications. The conventional pipelined architecture is usually power-hungry due to the substantial use of residue amplifiers (RAs)
ISSCC 2025
Session 24
Data Converters
A 12b 3GS/s Pipelined ADC with Gated-LMS-Based Piecewise-Linear Nonlinearity Calibration
The pipelined ADC is an attractive choice for high-speed and high-resolution applications. Its most important building block is the residue amplifier. Compared with conventional closed-loop amplifiers, open-loop amplifie
ISSCC 2025
Session 23
Other
Slim-Llama: A 4.69mW Large-Language-Model Processor with Binary/Ternary Weights for Billion-Parameter Llama Model
Recently, multiple ASICs [1-6] have been proposed to accelerate large language models (LLMs). However, the enormous number of LLM parameters leads to significant energy consumption due to external memory access (EMA). Wh
ISSCC 2025
Session 23
Other
An 88.36TOPS/W Bit-Level-Weight-Compressed Large-Language-Model Accelerator with Cluster-Aligned INT-FP-GEMM and Bi-Dimensional Workflow Reformulation
range of natural language processing (NLP) tasks, becoming an essential part of modern society [1-4]. This exceptional performance can be attributed to huge model size and autoregressive computation [5,6]. However, these
ISSCC 2025
Session 23
Other
BROCA: A 52.4-to-559.2mW Mobile Social Agent System-on-Chip with Adaptive Bit-Truncate Unit and Acoustic-Cluster Bit Grouping computation. The ACE PE processes input data in a bit-serial manner, where four 8b weights are accumulated in parallel, leading to a decrease in compute energy proportional to the input bitwidth. As a result, an average reduction of 4.4b in input bitwidth and a 4.7× speedup can be achieved, reducing computation energy by 44.5% at the RG.
Dongseok Im, Sangyeob Kim, Sangjin Kim, Taekwon Lee, Hoi-Jun Yoo Figure 23.7.4 illustrates the proposed ACBU, which achieves runtime bitwidth reduction of the vocoder input feature map to reduce computation energy in the
ISSCC 2025
Session 23
Other
MEGA.mini: A Universal Generative AI Processor with a New Big/Little Core Architecture for NPU
Chung-Ang University, Seoul, Korea 1 2 The global AI market is growing explosively with the rise of generative AI applications, such as image manipulation and text-to-text/image/video creation. AI was primarily expected
ISSCC 2025
Session 23
Other
MAE: A 3nm 0.168mm2 576MAC Mini AutoEncoder with Line-based Depth-First Scheduling for Generative AI in Vision on Edge Devices
Chia-Yuan Cheng, Hung-Wei Chih, Po-Han Chiang, Ming-Hsuan Chiang, Yuan-Jung Kuo, Yu-Wei Wu, Yi-Syuan Chen, Po-Heng Chen, Sandy Huang, Ming-En Shih, Chia-Ping Chen, Abrams Chen, ShenKai Chang, Chih-Ming Wang, Po-Yu Yeh, J
ISSCC 2025
Session 23
Other
Nebula: A 28nm 109.8TOPS/W 3D PNN Accelerator Featuring
Changchun Zhou1, Tianling Huang1, Yanzhe Ma1, Yuzhe Fu1, Xiangjie Song1, Siyuan Qiu1, Jiacong Sun1, Min Liu1, Ge Li1, Yifan He2, Yuchao Yang1,3, Hailong Jiao1 Peking University, Shenzhen, China Reconova Technologies, Xia
ISSCC 2025
Session 23
Other
EdgeDiff: 418.4mJ/Inference Multi-Modal Few-Step Diffusion Model Accelerator with Mixed-Precision and Reordered Group Quantization
need for high-performing image-generative models, including the diffusion model (DM) [2, 3]. A conventional DM requires numerous UNet-based denoising timesteps (~50), leading to high computation and external memory acces
ISSCC 2025
Session 23
AI / ML
A 28nm 0.22µJ/Token Memory-Compute-Intensity-Aware CNN-Transformer Accelerator with Hybrid-Attention-Based Layer-Fusion and Cascaded Pruning for Semantic-Segmentation
Luhong Liang2, Yitong Zhou2, Di Pang2, Man-To Yung2, Dong Zhang1,2, Xijie Huang1,2, Shih-Yang Liu1,2, Yongkun Wu1,2, Fengshi Tian1,2, Chi-Ying Tsui1,2, Fengbin Tu1,2, Kwang-Ting Cheng1,2 The Hong Kong University of Scien
ISSCC 2025
Session 23
Other
HuMoniX: A 57.3fps 12.8TFLOPS/W Text-to-Motion Processor with Inter-Iteration Output Sparsity and Inter-Frame Joint Similarity
media applications, such as film production and AR/VR. This process involves creating human joint movements and constructing detailed 3D meshes, like human skin, for each joint (see Fig. 23.10.1). It used to require hour
ISSCC 2025
Session 23
AI / ML
T-REX: A 68-to-567µs/Token 0.41-to-3.95µJ/Token Transformer Accelerator with Reduced External Memory Access and Enhanced Hardware Utilization in 16nm FinFET
revolutionized a wide range of AI applications, which motivates a surge in research to develop energy-efficient hardware accelerators. Most prior efforts have concentrated on enhancing on-chip computational energy effici
ISSCC 2025
Session 22
Memory
A 0.3pJ/b 32Gb/s/pin Single-Ended PAM-4 Receiver with a Delay-Less Capacitive-Feedback Equalizer
multi-level signaling techniques such as PAM3 and PAM4 are being increasingly adopted [1-7]. However, the lower SNR due to multi-level signaling necessitates complex equalization, increasing power consumption and area. T
ISSCC 2025
Session 22
Memory
A 32-to-50Gb/s/pin Single-Ended PAM-4 Transmitter with a ZQ-Based FFE and PAM-4 LSB DBI-DC Encoding
demand for data processing and transmission has surged: highlighting the need for high-speed and energy-efficient data transmission between processors and memory. While data processing capabilities continue to advance, t
ISSCC 2025
Session 22
Memory
A 42Gb/s Single-Ended Hybrid-DFE PAM-3 Receiver for GDDR7 Memory Interfaces
Changhyun Pyo1, Seulgi Kim1, Byungjun Kang1, Eunji Song1, Kwangjin Na1, Jinyoup Cha1, Hyesoo Kim1, Shinyoung Park1, Woo-Seok Choi2, Kyunghoon Kim1, Hae-Kang Jung1, Joohwan Cho1, Jonghwan Kim1 SK hynix, Icheon, Korea Seou
ISSCC 2025
Session 22
Memory
An 850μW 2-to-5GHz Jitter-Filtering and Instant-Toggling Injection-Locked Quadrature-Clock Generator for Low-Power Clock Distribution in HBM Interfaces
KAIST, Daejeon, Korea 1 2 *Equally Credited Authors (ECAs) The explosive expansion of generative AI, in various industries, has led to a surge in demand for high-bandwidth memory (HBM) devices that feature thousands of D
ISSCC 2025
Session 22
Memory
A 0.275pJ/b 42Gb/s/pin Clock-Referenced PAM3 Transceiver
multi-chip modules (MCMs), die-to-die (D2D), and chiplet interfaces (e.g. UCIe) requires high-bandwidth densities while minimizing power consumption [1,3,4,11-13]. Single-ended (SE) PAM3 signaling has been adopted in GDD
ISSCC 2025
Session 21
Power Management
A 20MHz &1MHz Dual-Loop Non-Uniform-Multi-Inductor Hybrid DC-DC Converter with Specified Inductor Current Allocation and Fast Transient Response
Chi-Seng Lam1, Rui P. Martins1, Yan Lu1,2,3 University of Macau, Macau, China UM Hetao IC Research Institute, Shenzhen, China 3 Tsinghua University, Beijing, China 1 2 *Equally Credited Authors (ECAs) High-efficiency, hi
ISSCC 2025
Session 21
Power Management
HOOP: A Scalable Hybrid DC-DC Converter Ring for HighPerformance Computing
Rui P. Martins1, Yan Lu1,2,3 University of Macau, Macau, China Tsinghua University, Beijing, China 3 UM Hetao IC Research Institute, Shenzhen, China 4 Leibniz University Hannover, Hannover, Germany 1 2 *Equally Credited