技术领域

Memory

266 篇相关论文 (2008–2026)

ISSCC 2021 Session 25 Memory
A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation
Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Jihyo Kang, Gangsik Lee,
Sangyeon Byeon, Youngtaek Kim, Boram Kim, Dong-Hyun Kim, Yeongmuk Cho, Kangmoo Choi, Hyeongyeol Park , Junghwan Ji, Sera Jeong, Yongsuk Joo, Jaehoon Cha, Minsoo Park, Hongdeuk Kim, Sijun Park, Kyubong Kong, Sunho Kim, Sa
ISSCC 2021 Session 24 Memory
A 5nm 5.7GHz@1.0V and 1.3GHz@0.5V 4kb Standard-CellBased Two-Port Register File with a 16T Bitcell with No Half-Selection Issue
Hidehiro Fujiwara, Yi-Hsin Nien, Chih-Yu Lin, Hsien-Yu Pan, Hao-Wen Hsu,
the minimum operating voltage (VMIN). Furthermore, fin formation differences between the SRAM bitcells, the peripheral circuits and the standard logic degrade area efficiency due to the empty spaces at fin-to-fin boundar
ISSCC 2021 Session 24 Memory
A 3nm Gate-All-Around SRAM Featuring an Adaptive Dual-BL and an Adaptive Cell-Power Assist Circuit
Taejoong Song, Woojin Rim, Hoonki Kim, Keun Hwi Cho, Taeyeong Kim,
TaeJung Lee, Geumjong Bae, Dong-Won Kim, SD Kwon, Sanghoon Baek, Jonghoon Jung, Jongwook Kye, Hakchul Jung, Hyungtae Kim, Soon-Moon Jung, Jaehong Park Samsung Electronics, Hwaseong, Korea Advanced technologies help to im
ISSCC 2021 Session 24 Memory
A 14nm-FinFET 1Mb Embedded 1T1R RRAM with a 0.022µm2 Cell Size Using Self-Adaptive Delayed Termination and MultiCell Reference
Jianguo Yang1,2, Xiaoyong Xue3, Xiaoxin Xu1, Qiao Wang1, Haijun Jiang2,
Lab, Hangzhou, China 3 Fudan University, Shanghai, China 1 2 High-density embedded nonvolatile memory (eNVM) at advanced technology nodes is still in great demand for SOC chips used in consumer electronics, self-driving
ISSCC 2021 Session 24 Memory
A 6.2 GHz Single Ended Current Sense Amplifier (CSA) Based Compileable 8T SRAM in 7nm FinFET Technology
Alexander Fritsch1, Rajiv Joshi2, Sudipto Chakraborty2, Holger Wetter1,
Uma Srinivasan1, Matthew Hyde3, Otto Torreiter1, Michael Kugel1, Dan Radko3, Hyong Kim3, Daniel Friedman2 IBM, Boeblingen, Germany IBM Research, Yorktown Heights, NY 3 IBM, Poughkeepsie, NY 1 2 8T SRAM, using domino read
ISSCC 2021 Session 16 Memory
An 89TOPS/W and 16.3TOPS/mm2 All-Digital SRAM-Based Full-Precision Compute-In Memory Macro in 22nm for Machine-Learning Edge Applications
Yu-Der Chih, Po-Hao Lee, Hidehiro Fujiwara, Yi-Chun Shih, Chia-Fu Lee,
Rawan Naous, Yu-Lin Chen, Chieh-Pu Lo, Cheng-Han Lu, Haruki Mori, Wei-Chang Zhao, Dar Sun, Mahmut E. Sinangil, Yen-Huei Chen, Tan-Li Chou, Kerem Akarvardar, Hung-Jen Liao, Yih Wang, Meng-Fan Chang, Tsung-Yung Jonathan Ch
ISSCC 2021 Session 16 Memory
A 28nm 384kb 6T-SRAM Computation-in-Memory Macro with 8b Precision for AI Edge Chips VGBL= (VMM15 × CGBL15 + VMM14 × CGBL14 + … + VMM0 × CGBL0)/(CGBL15 + CGBL14 + … + CGBL0). The voltage of GBLB (VGBLB) is the pMACV of 2bIN×1bW with 16-channel accumulation using the LSB part of a 4b-input (IN10).
Jian-Wei Su*1,2, Yen-Chi Chou*1, Ruhui Liu1, Ta-Wei Liu1, Pei-Jung Lu1,
Ping-Chun Wu1, Yen-Lin Chung1, Li-Yang Hung1, Jin-Sheng Ren1, Tianlong Pan1, Sih-Han Li2, Shih-Chieh Chang2, Shyh-Shyuan Sheu2, Wei-Chung Lo2, Chih-I Wu2, Xin Si1, Chung-Chuan Lo1, Ren-Shuo Liu1, Chih-Cheng Hsieh1, Kea-T
ISSCC 2021 Session 16 Memory
A 22nm 4Mb 8b-Precision ReRAM Computing-in-Memory Macro with 11.91 to 195.7TOPS/W for Tiny AI Edge Devices
Cheng-Xin Xue*1, Je-Min Hung*1, Hui-Yao Kao1, Yen-Hsiang Huang1,
Sheng-Po Huang1, Fu-Chun Chang1, Peng Chen1, Ta-Wei Liu1, Chuan-Jia Jhang1, Chin-I Su2, Win-San Khwa2, Chung-Chuan Lo1, Ren-Shuo Liu1, Chih-Cheng Hsieh1, Kea-Tiong Tang1, Yu-Der Chih2, Tsung-Yung Jonathan Chang2, Meng-Fa
ISSCC 2020 Session 33 Memory
Via-Switch FPGA: 65nm CMOS Implementation and Architecture Extension for AI Applications
Masanori Hashimoto1, Xu Bai2, Naoki Banno2, Munehiro Tada2,
Toshitsugu Sakamoto2, Jaehoon Yu1, Ryutaro Doi1, Yusuke Araki3, Hidetoshi Onodera3, Takashi Imagawa4, Hiroyuki Ochi4, Kazutoshi Wakabayashi5, Yukio Mitsuyama6, Tadahiko Sugibayashi2 Osaka University, Suita, Japan, 2NEC,
ISSCC 2020 Session 33 Memory
A 74 TMACS/W CMOS-RRAM Neurosynaptic Core with Dynamically Reconfigurable Dataflow and In-situ Transposable Weights for Probabilistic Graphical Models
Weier Wan1, Rajkumar Kubendran2, S. Burc Eryilmaz1, Wenqiang Zhang3,
Yan Liao3, Dabin Wu3, Stephen Deiss2, Bin Gao3, Priyanka Raina1, Siddharth Joshi4, Huaqiang Wu3, Gert Cauwenberghs2, H.-S. Philip Wong1 Stanford University, Stanford, CA, 2University of California, San Diego, CA, Tsinghu
ISSCC 2020 Session 22 Memory
A 0.8-to-2.3GHz Quadrature Error Corrector with Correctable Error Range of 101.6ps Using Minimum Total Delay Tracking and Asynchronous Calibration On-Off Scheme for DRAM Interface
Soyeong Shin1, Han-Gon Ko1, Sungchun Jang2, Dongkyun Kim2, Deog-Kyoon Jeong1
paths also increase. Thus, multiphase clocks are typically utilized in DRAMs to relax timing margins because of the reduced timing budget. However, phase errors between multiphase clocks, due to device mismatch, degrade
ISSCC 2020 Session 22 Memory
An 8nm 18Gb/s/pin GDDR6 PHY with TX Bandwidth Extension and RX Training Technique
Soo-Min Lee, Kihwan Seong, Joohee Shin, Hyoungjoong Kim,
Jaehyun Jeong, Shinyoung Yi, Juyoung Kim, Eunsu Kim, Sukhyun Jung, Sangyun Hwang, Jihun Oh, Kwanyeob Chae, Kyoung-Hoi Koo, Sanghune Park, Jongshin Shin, Jaehong Park Samsung Electronics, Hwaseong, Korea Recent emerging a
ISSCC 2020 Session 22 Memory
A 32Gb/s Digital-Intensive Single-Ended PAM-4 Transceiver for High-Speed Memory Interfaces Featuring a 2-Tap Time-Based Decision Feedback Equalizer and an In-Situ Channel-Loss Monitor
Po-Wei Chiu, Chris Kim
Single-ended transceivers that can deliver high-data rates at reduced supply voltages are required to meet the ever-growing demands of future memory interfaces. The performance of conventional non-return-to-zero (NRZ) li
ISSCC 2020 Session 22 Memory
A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo
Quarter Bank Structure, Power Dispersion and an, Instruction-Based At-Speed PMBIST
Dong Uk Lee, Ho Sung Cho, Jihwan Kim, Young Jun Ku, Sangmuk Oh, Chul Dae Kim, Hyun Woo Kim, Woo Young Lee, Tae Kyun Kim, Tae Sik Yun, Min Jeong Kim, SeungGyeon Lim, Seong Hee Lee, Byung Kuk Yun, Jun Il Moon, Ji Hwan Park
ISSCC 2020 Session 22 Memory
A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme
Chi-Sung Oh, Ki Chul Chun, Young-Yong Byun, Yong-Ki Kim,
So-Young Kim, Yesin Ryu, Jaewon Park, Sinho Kim, Sanguhn Cha, Donghak Shin, Jungyu Lee, Jong-Pil Son, Byung-Kyu Ho, Seong-Jin Cho, Beomyong Kil, Sungoh Ahn, Baekmin Lim, Yongsik Park, Kijun Lee, Myung-Kyu Lee, Seungduk B
ISSCC 2020 Session 13 Memory
A 128Gb 1b/Cell 96-Word-Line-Layer 3D Flash Memory to Improve Random Read Latency with tPROG=75µs and tR=4µs
Toshiyuki Kouchi1, Noriyasu Kumazaki1, Masashi Yamaoka1,
Sanad Bushnaq1, Takuyo Kodama1, Yuki Ishizaki1, Yoko Deguchi1, Akio Sugahara1, Akihiro Imamoto1, Norichika Asaoka1, Ryosuke Isomura1, Takaya Handa1, Junichi Sato2, Hiromitsu Komai1, Atsushi Okuyama1, Naoaki Kanagawa1, Ya
ISSCC 2020 Session 13 Memory
A 22nm 1Mb 1024b-Read and Near-Memory-Computing Dual-Mode STT-MRAM Macro with 42.6GB/s Read Bandwidth for Security-Aware Mobile Devices
Tung-Cheng Chang, Yen-Cheng Chiu, Chun-Ying Lee, Je-Min Hung,
Kuang-Tang Chang, Cheng-Xin Xue, Ssu-Yen Wu, Hui-Yao Kao, Peng Chen, Hsiao-Yu Huang, Shih-Hsih Teng, Meng-Fan Chang National Tsing Hua University, Hsinchu, Taiwan Many security-aware mobile devices, using the secure hash
ISSCC 2020 Session 13 Memory
A 22nm 32Mb Embedded STT-MRAM with 10ns Read
Speed, 1M Cycle Write Endurance, 10 Years Retention, at 150°C and High Immunity to Magnetic Field
Interference Yu-Der Chih, Yi-Chun Shih, Chia-Fu Lee, Yen-An Chang, Po-Hao Lee, Hon-Jarn Lin, Yu-Lin Chen, Chieh-Pu Lo, Meng-Chun Shih, Kuei-Hung Shen, Harry Chuang, Tsung-Yung Jonathan Chang TSMC, Hsinchu, Taiwan STT-MRA
ISSCC 2020 Session 13 Memory
A 1Tb 4b/Cell 96-Stacked-WL 3D NAND Flash Memory with 30MB/s Program Throughput Using Peripheral Circuit Under Memory Cell Array Technique pairs for low input offset to reduce a random dopant fluctuation. In order to reduce an input offset, the error amplifier designs that DC gain is above 74dB with all PVT variations. The Monte-Carlo simulation shows the variation is decreased by 46.9%, comparing to conventional one.
Hwang Huh, Wanik Cho, Jinhaeng Lee, Yujong Noh, Yongsoon Park,
Sunghwa Ok, Jongwoo Kim, Kayoung Cho, Hyunchul Lee, Geonu Kim, Kangwoo Park, Kwanho Kim, Heejoo Lee, Sooyeol Chai, Chankeun Kwon, Hanna Cho, Chanhui Jeong, Yujin Yang, Jayoon Goo, Jangwon Park, Juhyeong Lee, Heonki Kim,
ISSCC 2019 Session 24 Memory
Sandwich-RAM: An Energy-Efficient In-Memory BWN Architecture with Pulse-Width Modulation
Jun Yang1, Yuyao Kong1, Zhen Wang2, Yan Liu1, Bo Wang1, Shouyi Yin3, Longxin Shi1
state-of-the-art results in the field of visual perception, drastically changing the traditional computer-vision framework. However, the movement of massive amounts of data prevents CNN’s from being integrated into low-po
ISSCC 2019 Session 24 Memory
A Voltage and Temperature Tracking SRAM Assist Supporting 740mV Dual-Rail Offset for Low-Power and High-Performance Applications in 7nm EUV FinFET Technology
Inhak Lee, Hanwool Jeong, Sangyeop Baeck, Siddharth Gupta,
Changnam Park, Dongwook Seo, Jaesung Choi, Jaeyoung Kim, Hoon Kim, Jungmyung Kang, Sunyung Jang, Daeyoung Moon, Sangshin Han, Taehyung Kim, Jaehyun Lim, Younghwan Park, Hyejin Hwang, Jeonseung Kang, Jaeseung Choi, Taejoo
ISSCC 2019 Session 24 Memory
A 7nm 2.1GHz Dual-Port SRAM with WL-RC Optimization and Dummy-Read-Recovery Circuitry to Mitigate ReadDisturb-Write Issue
Hidehiro Fujiwara, Chih-Yu Lin, Hsien-Yu Pan, Cheng-Han Lin,
and wire routing resistance and capacitance; it degrades SRAM performance and results in SRAM design difficulties. Although dual-port (DP) SRAM is useful, because it can offer simultaneous read and write operations with t
ISSCC 2019 Session 23 Memory
A 512GB 1.1V Managed DRAM Solution with 16GB ODP and Media Controller
Seongju Lee, Byungdeuk Jeon, Kyeongpil Kang, Dongyoon Ka,
Nayeon Kim, Yongseop Kim, Yunseok Hong, Mankeun Kang, Jinyong Min, Mingyu Lee, Chunseok Jeong, Kwandong Kim, Doobock Lee, Junghyun Shin, Yuntack Han, Youngbo Shim, Youngjoo Kim, Yongsun Kim, Hyunseok Kim, Jaewoong Yun, B
ISSCC 2019 Session 23 Memory
A 3-bit/2UI 27Gb/s PAM-3 Single-Ended Transceiver Using One-Tap DFE for Next-Generation Memory Interface
Hyunsu Park1, Junyoung Song2, Yeonho Lee1, Jincheol Sim1,
high-data throughput while maintaining single-ended signaling and the supply voltage of I/O has been scaled down. Due to the increasing interface bandwidth the required area and power consumption has increased as well, r
ISSCC 2019 Session 23 Memory
A 1.1V 1ynm 6.4Gb/s/pin 16Gb DDR5 SDRAM with a
Phase-Rotator-Based DLL, High-Speed SerDes and, RX/TX Equalization Scheme
write (MRW) setting. 3rd step is fine training, sweeping the DQS signal to find the rising edge of IWES. After the training, IWES and DQS are matched without any additional delay. Therefore, it saves the power consumption
ISSCC 2019 Session 23 Memory
A 7.5Gb/s/pin LPDDR5 SDRAM with WCK Clocking and
Non-Target ODT for High Speed and with DVFS, Internal
Data Copy, and Deep-Sleep Mode for Low Power Kyung-Soo Ha, Chang-Kyo Lee, Dongkeon Lee, Daesik Moon, Jin-Hun Jang, Hyong-Ryol Hwang, Hyungjoon Chi, Junghwan Park, Seungjun Shin, Dukha Park, Sang-Yun Kim, Sukhyun Lim, Kiw
ISSCC 2019 Session 13 Memory
A 512Gb 3-bit/Cell 3D Flash Memory on 128-WordlineLayer with 132MB/s Write Performance Featuring CircuitUnder-Array Technology
Chang Siau1, Kwang-Ho Kim1, Seungpil Lee1, Katsuaki Isobe2,
Noboru Shibata2, Kapil Verma1, Takuya Ariki1, Jason Li1, Jong Yuh1, Anirudh Amarnath1, Qui Nguyen1, Ohwon Kwon1, Stanley Jeong1, Heguang Li1, Hua-Ling Hsu1, Tai-yuan Tseng1, Steve Choi1, Siddhesh Darne1, Pradeep Anantula
ISSCC 2019 Session 13 Memory
A 512Gb 3-bit/Cell 3D 6th-Generation V-NAND Flash Memory with 82MB/s Write Throughput and 1.2Gb/s Interface In this work, to minimize the capacitive coupling between WLN and WLN+1, we
apply a copy of the selected WL voltage to WLN+1, as shown in Fig. 13.4.3(b). This, technique improves the programming t
for the verify operations. Dongku Kang, Minsu Kim, Su Chang Jeon, Wontaeck Jung, Jooyong Park, Gyosoo Choo, Dong-kyo Shim, Anil Kavala, Seung-Bum Kim, Kyung-Min Kang, Jiyoung Lee, Kuihan Ko, Hyun-Wook Park, Byung-Jun Min
ISSCC 2019 Session 13 Memory
A 7Mb STT-MRAM in 22FFL FinFET Technology with 4ns Read Sensing Time at 0.9V Using Write-Verify-Write Scheme and Offset-Cancellation Sensing Technique
Liqiong Wei, Juan G. Alzate, Umut Arslan, Justin Brockman,
Nilanjan Das, Kevin Fischer, Tahir Ghani, Oleg Golonzka, Patrick Hentges, Rawshan Jahan, Pulkit Jain, Blake Lin, Mesut Meterelliyoz, Jim O’Donnell, Conor Puls, Pedro Quintero, Tanaya Sahu, Meenakshi Sekhar, Ajay Vangapat
ISSCC 2019 Session 13 Memory
A 3.6Mb 10.1Mb/mm2 Embedded Non-Volatile ReRAM Macro in 22nm FinFET Technology with Adaptive Forming/Set/Reset Schemes Yielding Down to 0.5V with Sensing Time of 5ns at 0.7V
Pulkit Jain, Umut Arslan, Meenakshi Sekhar, Blake C. Lin, Liqiong Wei,
Tanaya Sahu, Juan Alzate-vinasco, Ajay Vangapaty, Mesut Meterelliyoz, Nathan Strutt, Albert B. Chen, Patrick Hentges, Pedro A. Quintero, Chris Connor, Oleg Golonzka, Kevin Fischer, Fatih Hamzaoglu Intel, Hillsboro, OR A
ISSCC 2019 Session 13 Memory
A 1.33Tb 4-bit/Cell 3D-Flash Memory on a 96-Word-LineLayer Technology
N. Shibata1, K. Kanda1, T. Shimizu1, J. Nakai1, O. Nagao1, N. Kobayashi1,
M. Miakashi1, Y. Nagadomi1, T. Nakano1, T. Kawabe1, T. Shibuya1, M. Sako1, K. Yanagidaira1, T. Hashimoto1, H. Date1, M. Sato1, T. Nakagawa1, H. Takamoto1, J. Musha1, T. Minamoto1, M. Uda1, D. Nakamura1, K. Sakurai1, T. Y
ISSCC 2018 Session 20 Memory
A 1Tb 4b/Cell 64-Stacked-WL 3D NAND Flash Memory with 12MB/s Program Throughput
Seungjae Lee, Chulbum Kim, Minsu Kim, Sung-min Joe, Joonsuc Jang,
Seungbum Kim, Kangbin Lee, Jisu Kim, Jiyoon Park, Han-Jun Lee, Minseok Kim, Seonyong Lee, SeonGeon Lee, Jinbae Bang, Dongjin Shin, Hwajun Jang, Deokwoo Lee, Nahyun Kim, Jonghoo Jo, Jonghoon Park, Sohyun Park, Youngsik Rh
ISSCC 2018 Session 20 Memory
A Flash Memory Controller for 15μs Ultra-Low-Latency SSD Using High-Speed 3D NAND Flash with 3μs Read Time
Wooseong Cheong, Chanho Yoon, Seonghoon Woo, Kyuwook Han,
Daehyun Kim, Chulseung Lee, Youra Choi, Shine Kim, Dongku Kang, Geunyeong Yu, Jaehong Kim, Jaechun Park, Ki-Whan Song, Ki-Tae Park, Sangyeun Cho, Hwaseok Oh, Daniel DG Lee, Jin-Hyeok Choi, Jaeheon Jeong Samsung Electroni
ISSCC 2018 Session 20 Memory
A 512Gb 3b/Cell 3D Flash Memory on a 96-Word-Line-Layer Technology
Hiroshi Maejima1, Kazushige Kanda1, Susumu Fujimura1,
Teruo Takagiwa1, Susumu Ozawa1, Jumpei Sato1, Yoshihiko Shindo1, Manabu Sato1, Naoaki Kanagawa1, Junji Musha1, Satoshi Inoue1, Katsuaki Sakurai1, Naohito Morozumi1, Ryo Fukuda1, Yuui Shimizu1, Toshifumi Hashimoto1, Xu Li
ISSCC 2018 Session 12 Memory
A 16Gb 1.2V 3.2Gb/s/pin DDR4 SDRAM with Improved Power Distribution and Repair Strategy
Seokbo Shim, Sungho Kim, Jooyoung Bae, Keunsik Ko, Eunryeong Lee,
Kwidong Kim, Kyeongtae Kim, Sangho Lee, Jinhoon Hyun, Insung Koh, Joonhong Park, Minjeong Kim, Sunhye Shin, Dongha Lee, Yunyoung Lee, Sangah Hyun, Wonjohn Choi, Dain Im, Dongheon Lee, Jieun Jang, Sangho Lee, Junhyun Chun
ISSCC 2018 Session 12 Memory
A 16Gb/s/pin 8Gb GDDR6 DRAM with Bandwidth Extension Techniques for High-Speed Applications
Kyu-Dong Hwang, Boram Kim, Sang-Yeon Byeon, Kyu-Young Kim,
Dae-Han Kwon, Hyun-Bae Lee, Geun-Il Lee, Sang-Sic Yoon, Jin-Youp Cha, Soo-Young Jang, Seung-Hun Lee, Yong-Suk Joo, Gang-Sik Lee, Sung-Soo Xi, Soo-Bin Lim, Kyung-Ho Chu, Joo-Hwan Cho, Junhyun Chun, Jonghoon Oh, Jinkook Ki
ISSCC 2018 Session 12 Memory
A 1.2V 64Gb 341GB/s HBM2 Stacked DRAM with Spiral Point-to-Point TSV Structure and Improved Bank Group Data Control
Jin Hee Cho, Jihwan Kim, Woo Young Lee, Dong Uk Lee, Tae Kyun Kim,
Heat Bit Park, Chunseok Jeong, Myeong-Jae Park, Seung Geun Baek, Seokwoo Choi, Byung Kuk Yoon, Young Jae Choi, Kyo Yun Lee, Daeyong Shim, Jonghoon Oh, Jinkook Kim, Seok-Hee Lee SK hynix, Gyeonggi, Korea With the recent i
ISSCC 2018 Session 12 Memory
A 16Gb LPDDR4X SDRAM with an NBTI-Tolerant
Circuit Solution, an SWD PMOS GIDL Reduction
Technique, an Adaptive Gear-Down Scheme and a Metastable-Free DQS Aligner in a 10nm Class DRAM Process Ki Chul Chun, Yong-Gyu Chu, Jin-Seok Heo, Tae-Sung Kim, Soohwan Kim, Hui-Kap Yang, Mi-Jo Kim, Chang-Kyo Lee, Juhwan K
ISSCC 2018 Session 12 Memory
A 16Gb 18Gb/s/pin GDDR6 DRAM with Per-Bit Trainable Single-Ended DFE and PLL-Less Clocking
Young-Ju Kim, Hye-Jung Kwon, Su-Yeon Doo, Yoon-Joo Eom,
Young-Sik Kim, Min-Su Ahn, Yong-Hun Kim, Sang-Hoon Jung, Sung-Geun Do, Chang-Yong Lee, Jae-Sung Kim, Dong-Seok Kang, Kyung-Bae Park, Jung-Bum Shin, Jong-Ho Lee, Seung-Hoon Oh, Sang-Yong Lee, Ji-Hak Yu, Ji-Suk Kwon, Ki-Hu
ISSCC 2018 Session 11 Memory
A 5GHz 7nm L1 Cache Memory Compiler for High-Speed Computing and Mobile Applications
Michael Clinton1, Rajinder Singh1, Marty Tsai1, Shayan Zhang1,
will typically determine the maximum frequency (fMAX) of the processor core. Companies that mass produce high-performance microprocessors commonly have the L1 cache consist of fully-custom macros: to ensure that the perf
ISSCC 2018 Session 11 Memory
A 7nm FinFET SRAM Using EUV Lithography with Dual Write-Driver-Assist Circuitry for Low-Voltage Applications
Taejoong Song, Jonghoon Jung, Woojin Rim, Hoonki Kim, Yongho Kim,
Changnam Park, Jeongho Do, Sunghyun Park, Sungwee Cho, Hyuntaek Jung, Bongjae Kwon, Hyun-Su Choi, JaeSeung Choi, Jong Shik Yoon Samsung Electronics, Hwaseong, Korea SRAM plays an integral role in the power, performance,
ISSCC 2018 Session 11 Memory
A 23.6Mb/mm2 SRAM in 10nm FinFET Technology with Pulsed PMOS TVC and Stepped-WL for Low-Voltage Applications
Zheng Guo, Daeyeon Kim, Satyanand Nalam, Jami Wiedemer,
accompanied by a sustained growth of battery-powered mobile devices, continues to drive the importance of energy and area efficient CPU and SoC designs. Low-voltage operation remains one of the primary approaches for act
ISSCC 2017 Session 23 Memory
An 8-Channel 4.5Gb 180GB/s 18ns-Row-Latency RAM for the Last Level Cache
Tah-Kang Joseph Ting1, Gyh-Bin Wang1, Ming-Hung Wang1,
Chun-Peng Wu1, Chun-Kai Wang1, Chun-Wei Lo1, Li-Chin Tien1, Der-Min Yuan1, Yung-Ching Hsieh1, Jenn-Shiang Lai2, Wen-Pin Hsu2, Chien-Chih Huang2, Chi-Kang Chen2, Yung-Fa Chou2, Ding-Ming Kwai2, Zhe Wang3, Wei Wu3, Shigeki
ISSCC 2017 Session 23 Memory
A 1V 7.8mW 15.6Gb/s C-PHY Transceiver Using Tri-Level Signaling for Post-LPDDR4
Woojun Choi1, Taewoong Kim1, Jongjoo Shim2, Hyungsoo Kim2,
smartphones and tablet PCs [1, 2]. Since mobile DRAM standard (LPDDR), for the next generation, targets the speed specification of 51.2GB/s, its I/O interface demands high bandwidth, low power and high efficiency. Single
ISSCC 2017 Session 23 Memory
A Time-Based Receiver with 2-tap DFE for a 12Gb/s/pin Single-Ended Transceiver of Mobile DRAM Interface in 0.8V 65nm CMOS
Il-Min Yi1, Min-Kyun Chae1, Seok-Hun Hyun2, Seung-Jun Bae2,
Single-ended transceivers are mostly used for DRAM interfaces to reduce pin count. A low-supply transceiver is preferred, especially for mobile DRAM interfaces, for low-power consumption while maintaining a high-speed in
ISSCC 2017 Session 23 Memory
A 0.6V 4.266Gb/s/pin LPDDR4X Interface with AutoDQS Cleaning and Write-VWM Training for Memory Controller
Soo-Min Lee, Jihun Oh, Jinho Choi, Seokkyun Ko, Daero Kim,
Kyounghoi Koo, Jongryun Choi, Yoonjee Nam, Sangsoo Park, Hyungkweon Lee, Eunsu Kim, Sukhyun Jung, Kwanyeob Chae, Suho Kim, Sanghune Park, Sanghyun Lee, Sungho Park Samsung Electronics, Hwasung, Korea Although the LPDDR4
ISSCC 2017 Session 23 Memory
A 4Gb LPDDR2 STT-MRAM with Compact 9F2 1T1MTJ Cell and Hierarchical Bitline Architecture
Kwangmyoung Rho1, Kenji Tsuchida2, Dongkeun Kim1, Yutaka Shirai2,
Jihyae Bae1, Tsuneo Inaba2, Hiromi Noro2, Hyunin Moon1, Sungwoong Chung1, Kazumasa Sunouchi2, Jinwon Park1, Kiseon Park1, Akihito Yamamoto2, Seoungju Chung1, Hyeongon Kim1, Hisato Oyamatsu2, Jonghoon Oh1 SK hynix Semicon
ISSCC 2017 Session 23 Memory
An Extremely Low-Standby-Power 3.733Gb/s/pin 2Gb LPDDR4 SDRAM for Wearable Devices
Hye-Jung Kwon, Eunsung Seo, Chan-Yong Lee, Young-Hun Seo,
Gong-Heum Han, Hye-Ran Kim, Jong-Ho Lee, Min-Su Jang, Sung-Geun Do, Seung-Hyun Cho, Jae-Koo Park, Su-Yeon Doo, Jung-Bum Shin, Sang-Hoon Jung, Hyoung-Ju Kim, In-Ho Im, Beob-Rae Cho, Jae-Woong Lee, Jae-Youl Lee, Ki-Hun Yu,
ISSCC 2017 Session 23 Memory
A 4.8Gb/s/pin 2Gb LPDDR4 SDRAM with Sub-100μA Self-Refresh Current for IoT Applications
Nohhyup Kwak, Saeng-Hwan Kim, Kyong Ha Lee, Chang-Ki Baek,
Mun Seon Jang, Yongsuk Joo, Seung-Hun Lee, Woo Young Lee, Eunryeong Lee, Donghee Han, Jaeyeol Kang, Jung Ho Lim, Jae-Beom Park, Kyung-Tae Kim, Sunki Cho, Sung Woo Han, Jee Yeon Keh, Jun Hyun Chun, Jonghoon Oh, Seok Hee L
ISSCC 2017 Session 23 Memory
A 5Gb/s/pin 8Gb LPDDR4X SDRAM with PowerIsolated LVSTL and Split-Die Architecture with 2-Die ZQ Calibration Scheme
Chang-Kyo Lee, Yoon-Joo Eom, Jin-Hee Park, Junha Lee, Hye-Ran Kim,
Kihan Kim, Young Choi, Ho-Jun Chang, Jonghyuk Kim, Jong-Min Bang, Seungjun Shin, Hanna Park, Sujin Park, Young-Ryeol Choi, Hoon Lee, Kyong-Ho Jeon, Jae-Young Lee, Hyo-Joo Ahn, Kyoung-Ho Kim, Jung-Sik Kim, Soobong Chang,